Microchip Technology 产品

DSC1004BI2-100.0000T

Microchip Technology

OSC MEMS 100.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 100MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 ~ 3.3V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 10.5mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

封装: 4-SMD, No Lead

DSC1001DI1-016.0000T

Microchip Technology

OSC MEMS 16.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 16MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

封装: 4-SMD, No Lead

DSC1121CI2-066.6660T

Microchip Technology

OSC MEMS 66.666MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 66.666MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 35mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

封装: 6-SMD, No Lead

TC593002ECBTR

Microchip Technology

IC REG LINEAR -3V 80MA SOT23-3

• Output Configuration: Negative
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): -10V
• Voltage - Output (Min/Fixed): -3V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.6V @ 80mA
• Current - Output: 80mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 7µA
• PSRR: -
• Control Features: -
• Protection Features: -
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SOT-23-3

封装: TO-236-3, SC-59, SOT-23-3

MCP1700-3302E/TO

Microchip Technology

IC REG LINEAR 3.3V 250MA TO92-3

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 6V
• Voltage - Output (Min/Fixed): 3.3V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.35V @ 250mA
• Current - Output: 250mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 4µA
• PSRR: 44dB (100Hz)
• Control Features: -
• Protection Features: Over Current, Over Temperature, Short Circuit
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA)
• Supplier Device Package: TO-92-3

封装: TO-226-3, TO-92-3 (TO-226AA)

AT93C46A-10SC-2.5

Microchip Technology

IC EEPROM 1KBIT 2MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 1Kb (128 x 8, 64 x 16)
• Memory Interface: SPI
• Clock Frequency: 2MHz
• Write Cycle Time - Word, Page: 10ms
• Access Time: -
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

封装: 8-SOIC (0.154", 3.90mm Width)

SST26VF064BT-104I/MN

Microchip Technology

IC FLASH 64MBIT 104MHZ 8WDFN

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 64Mb (8M x 8)
• Memory Interface: SPI - Quad I/O
• Clock Frequency: 104MHz
• Write Cycle Time - Word, Page: 1.5ms
• Access Time: -
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-WDFN Exposed Pad
• Supplier Device Package: 8-WDFN (6x8)

封装: 8-WDFN Exposed Pad

SY89545LMG

Microchip Technology

IC MUX 4:1 LVDS DIFF 3.3V 32MLF

• Type: Multiplexer
• Circuit: 1 x 4:1
• Independent Circuits: 1
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad, 32-MLF?
• Supplier Device Package: 32-MLF? (5x5)

封装: 32-VFQFN Exposed Pad, 32-MLF?

PIC24F08KM102-E/SP

Microchip Technology

IC MCU 16BIT 8KB FLASH 28SDIP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 8KB (2.75K x 24)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 19x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

封装: 28-DIP (0.300", 7.62mm)

DSPIC33EP128MC502-E/SP

Microchip Technology

IC MCU 16BIT 128KB FLASH 28SDIP

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 60 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, QEI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 128KB (43K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

封装: 28-DIP (0.300", 7.62mm)

DSPIC33EP256GM706-E/MR

Microchip Technology

IC MCU 16BIT 256KB FLASH 64QFN

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 60 MIPs
• Connectivity: CAN, I2C, IrDA, LIN, QEI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 256KB (85.5K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 30x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

封装: 64-VFQFN Exposed Pad

ATSAMC21J17A-MNT

Microchip Technology

IC MCU 32BIT 128KB FLASH 64QFN

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: CAN, I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
• Number of I/O: 52
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 20x12b, 3x16b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-VQFN (9x9)

封装: 64-VFQFN Exposed Pad

EMC1046-6-AIZL-TR

Microchip Technology

SENSOR TEMPERATURE SMBUS 10TSSOP

• Sensor Type: Digital, Local/Remote
• Sensing Temperature - Local: -40°C ~ 125°C
• Sensing Temperature - Remote: -40°C ~ 125°C
• Output Type: SMBus
• Voltage - Supply: 3 V ~ 3.6 V
• Resolution: 10 b
• Features: One-Shot, Output Switch, Programmable Limit, Standby Mode
• Accuracy - Highest (Lowest): ±1°C (±2°C)
• Test Condition: 0°C ~ 100°C (-40°C ~ 125°C)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 10-TSSOP

封装: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)

ATR2820-DEMOBOARD

Microchip Technology

BOARD DEMO REF DESIGN 5.8GHZ

• Type: Transceiver
• Frequency: -
• For Use With/Related Products: ATR2820
• Supplied Contents: -

封装: -

PIC32MK0256MCJ064-E-R4X

Microchip Technology

IC MCU 32BIT 256KB FLASH 64VQFN

• Core Processor: MIPS32® microAptiv™
• Core Size: 32-Bit Single-Core
• Speed: 80MHz
• Connectivity: CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, Motor Control PWM, WDT
• Number of I/O: 53
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
• Data Converters: A/D 30x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-VQFN (9x9)

封装: -

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JAN2N336ALT2

Microchip Technology

TRANS NPN 45V 0.01A TO5

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 10 mA
• Voltage - Collector Emitter Breakdown (Max): 45 V
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-205AA, TO-5-3 Metal Can
• Supplier Device Package: TO-5AA

封装: -

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CD4746A

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 18 V
• Tolerance: ±5%
• Power - Max: 1 W
• Impedance (Max) (Zzt): 20 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 13.7 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

封装: -

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1N937A

Microchip Technology

DIODE ZENER

• Voltage - Zener (Nom) (Vz): 9 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 20 Ohms
• Current - Reverse Leakage @ Vr: -
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

封装: -

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MCP6009-E-SLVAO

Microchip Technology

1 MHZ GEN PURPOSE QUAD OP-AMP WI

• Amplifier Type: Standard
• Number of Circuits: 4
• Output Type: Single-Ended
• Slew Rate: 1.9V/µs
• Gain Bandwidth Product: 1 MHz
• -3db Bandwidth: -
• Current - Input Bias: 1 pA
• Voltage - Input Offset: 1.6 mV
• Current - Supply: 50µA (x4 Channels)
• Current - Output / Channel: 30 mA
• Voltage - Supply, Single/Dual (±): -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SOIC

封装: -

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CDLL5266C

Microchip Technology

DIODE ZENER 68V DO-213AA

• Voltage - Zener (Nom) (Vz): 68 V
• Tolerance: ±2%
• Power - Max: -
• Impedance (Max) (Zzt): 230 Ohms
• Current - Reverse Leakage @ Vr: 100 nA @ 52 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

封装: -

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CDLL4577E3-TR

Microchip Technology

DIODE ZENER TEMP COMPENSATED

• Voltage - Zener (Nom) (Vz): -
• Tolerance: -
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 50 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: 0°C ~ 75°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

封装: -

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S31100

Microchip Technology

STD RECTIFIER

• Diode Type: -
• Voltage - DC Reverse (Vr) (Max): -
• Current - Average Rectified (Io): -
• Voltage - Forward (Vf) (Max) @ If: -
• Speed: -
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -
• Operating Temperature - Junction: -

封装: -

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JANS1N935BUR-1

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 9 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 20 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 6 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA (Glass)
• Supplier Device Package: DO-213AA

封装: -

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JANSL2N3810L

Microchip Technology

DUAL RH SMALL-SIGNAL BJT

• Transistor Type: 2 PNP (Dual)
• Current - Collector (Ic) (Max): 50mA
• Voltage - Collector Emitter Breakdown (Max): 60V
• Vce Saturation (Max) @ Ib, Ic: 250mV @ 100µA, 1mA
• Current - Collector Cutoff (Max): 10µA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 1mA, 5V
• Power - Max: 350mW
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-78-6 Metal Can
• Supplier Device Package: TO-78-6

封装: -

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MSASC25H45KV

Microchip Technology

DIODE SCHOTTKY 45V 25A THINKEY2

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 45 V
• Current - Average Rectified (Io): 25A
• Voltage - Forward (Vf) (Max) @ If: 610 mV @ 20 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 1 mA @ 45 V
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: ThinKey™2
• Supplier Device Package: ThinKey™2
• Operating Temperature - Junction: -55°C ~ 150°C

封装: -

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ATTINY827-MF

Microchip Technology

IC MCU 8BIT 8KB FLASH 24VQFN

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 15x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-VQFN (4x4)

封装: -

1N5616US-TR

Microchip Technology

DIODE GEN PURP 400V 1A D-5A

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 400 V
• Current - Average Rectified (Io): 1A
• Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 3 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 2 µs
• Current - Reverse Leakage @ Vr: 500 nA @ 400 V
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, A
• Supplier Device Package: D-5A
• Operating Temperature - Junction: -65°C ~ 200°C

封装: -

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JANS1N5417

Microchip Technology

DIODE GEN PURP 200V 3A B AXIAL

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 200 V
• Current - Average Rectified (Io): 3A
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 9 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 150 ns
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: Through Hole
• Package / Case: B, Axial
• Supplier Device Package: B, Axial
• Operating Temperature - Junction: -65°C ~ 175°C

封装: -

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JANS1N4478D

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 36 V
• Tolerance: ±1%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 27 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 28.8 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO-41, Axial
• Supplier Device Package: DO-41

封装: -

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2N3440UA

Microchip Technology

NPN POWER SILICON TRANSISTORS

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 1 A
• Voltage - Collector Emitter Breakdown (Max): 250 V
• Vce Saturation (Max) @ Ib, Ic: 500mV @ 4mA, 50mA
• Current - Collector Cutoff (Max): 2µA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 20mA, 10V
• Power - Max: 800 mW
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Supplier Device Package: UA

封装: -

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