页 302 - Intel 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
1SX280LH2F55I1VG	Intel	2912-PIN FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存2,256
EP20K100CF144C7ES	Intel	IC FPGA Number of LABs/CLBs: 416 Number of Logic Elements/Cells: 4160 Total RAM Bits: 53248 Number of I/O: 93 Number of Gates: 263000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封装: 144-LQFP	库存7,536
10M08DFF484C7G	Intel	IC FPGA 250 I/O 484FBGA Number of LABs/CLBs: 500 Number of Logic Elements/Cells: 8000 Total RAM Bits: 387072 Number of I/O: 250 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BGA	库存7,776
EP1K50QC208-2N	Intel	IC FPGA 147 I/O 208QFP Number of LABs/CLBs: 360 Number of Logic Elements/Cells: 2880 Total RAM Bits: 40960 Number of I/O: 147 Number of Gates: 199000 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封装: 208-BFQFP	库存4,960
EP1S10F672C6N	Intel	IC FPGA 345 I/O 672FBGA Number of LABs/CLBs: 1057 Number of Logic Elements/Cells: 10570 Total RAM Bits: 920448 Number of I/O: 345 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BBGA	库存7,296
EP20K200EFC484-2	Intel	IC FPGA 376 I/O 484FBGA Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: 376 Number of Gates: 526000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封装: 484-BBGA	库存14,352
5SGXEABN2F45I3L	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 65561600 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: 1932-BBGA, FCBGA	库存5,392
5SGXEBBR2H43C2N	Intel	IC FPGA 600 I/O 1760HBGA Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Total RAM Bits: 65561600 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45x45)	封装: 1760-BBGA, FCBGA	库存5,568
5SGSED8N2F45I3L	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 262400 Number of Logic Elements/Cells: 695000 Total RAM Bits: 60968960 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: 1932-BBGA, FCBGA	库存5,696
EP4SGX180FF35C4	Intel	IC FPGA 564 I/O 1152FBGA Number of LABs/CLBs: 7030 Number of Logic Elements/Cells: 175750 Total RAM Bits: 13954048 Number of I/O: 564 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存4,512
5SGSMD3E2H29C2L	Intel	IC FPGA 360 I/O 780HBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 16937984 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33x33)	封装: 780-BBGA, FCBGA	库存2,096
5SGXMA5N3F40C3N	Intel	IC FPGA 600 I/O 1517FBGA Number of LABs/CLBs: 185000 Number of Logic Elements/Cells: 490000 Total RAM Bits: 53105664 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA, FCBGA	库存5,456
EP3SL110F780I3N	Intel	IC FPGA 488 I/O 780FBGA Number of LABs/CLBs: 4300 Number of Logic Elements/Cells: 107500 Total RAM Bits: 4992000 Number of I/O: 488 Number of Gates: - Voltage - Supply: 0.86 V ~ 1.15 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BBGA, FCBGA	库存4,992
EP4CE40F29C7N	Intel	IC FPGA 532 I/O 780FBGA Number of LABs/CLBs: 2475 Number of Logic Elements/Cells: 39600 Total RAM Bits: 1161216 Number of I/O: 532 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BGA	库存6,160
EP4CE30F29C9LN	Intel	IC FPGA 532 I/O 780FBGA Number of LABs/CLBs: 1803 Number of Logic Elements/Cells: 28848 Total RAM Bits: 608256 Number of I/O: 532 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BGA	库存3,312
EPM7192EQC160-12YY	Intel	IC CPLD 192MC 12NS 160QFP Programmable Type: EE PLD Delay Time tpd(1) Max: 12.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 12 Number of Macrocells: 192 Number of Gates: 3750 Number of I/O: 124 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	封装: 160-BQFP	库存2,064
EPM7128SLC84-10	Intel	IC CPLD 128MC 10NS 84PLCC Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 2500 Number of I/O: 68 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	封装: 84-LCC (J-Lead)	库存6,192
5AGTMC3D3F27I5G	Intel	IC FPGA 336 I/O 672FBGA Number of LABs/CLBs: 7362 Number of Logic Elements/Cells: 156000 Total RAM Bits: 11746304 Number of I/O: 336 Number of Gates: - Voltage - Supply: 1.07V ~ 1.13V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BBGA, FCBGA	库存2,416
EP2S130F1020I5N	Intel	IC FPGA 742 I/O 1020FBGA Number of LABs/CLBs: 6627 Number of Logic Elements/Cells: 132540 Total RAM Bits: - Number of I/O: 742 Number of Gates: - Voltage - Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1020-BBGA Supplier Device Package: 1020-FBGA (33x33)	封装: -	Request a Quote
5SGSMD3H3F35C4WN	Intel	IC FPGA 432 I/O 1152FBGA Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 432 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: -	Request a Quote
1SD280PT3F55I3VGS1	Intel	IC FPGA 816 I/O 2912FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: 2753000 Total RAM Bits: 240123904 Number of I/O: 816 Number of Gates: - Voltage - Supply: - Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA (55x55)	封装: -	Request a Quote
RK80532KE056512	Intel	IC MPU INTEL XEON 2.4GHZ 604PPGA Core Processor: Intel® Xeon® Processor Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 2.4GHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V Operating Temperature: 74°C (TC) Security Features: - Package / Case: 604-PGA Supplier Device Package: 604-PPGA (42.5x42.5)	封装: -	Request a Quote
AGFB023R25A1I1V	Intel	IC FPGA AGILEX-F 2581FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
5SGXEA7N1F45C1WN	Intel	IC FPGA 840 I/O 1932FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 840 Number of Gates: - Voltage - Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: -	Request a Quote
AGFC019R25A3E3E	Intel	IC FPGA AGILEX-F 2581FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
AGFA027R24C2I2V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
EP4SGX360KF43C2G	Intel	IC FPGA 880 I/O 1760FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
5SGSMD5K3F40I3LG	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 172600 Number of Logic Elements/Cells: 457000 Total RAM Bits: 39936000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: -	Request a Quote
EWIXP455BAC	Intel	IC MPU INTEL 400MHZ PBGA544 Core Processor: Intel® IXP45x Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: Mll (3), SMII (3) SATA: - USB: USB 1.1 (1), USB 2.0 (1) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: 3DES, AES, DES, MD5, RNG, SHA1 Package / Case: 544-BBGA Supplier Device Package: 544-PBGA (35x35)	封装: -	Request a Quote
5SGXMA4K2F35I3LG	Intel	IC FPGA 600 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 37888000 Number of I/O: 600 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: -	Request a Quote

1SX280LH2F55I1VG

Intel

2912-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存2,256

EP20K100CF144C7ES

Intel

IC FPGA

Number of LABs/CLBs: 416
Number of Logic Elements/Cells: 4160
Total RAM Bits: 53248
Number of I/O: 93
Number of Gates: 263000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封装: 144-LQFP

库存7,536

10M08DFF484C7G

Intel

IC FPGA 250 I/O 484FBGA

Number of LABs/CLBs: 500
Number of Logic Elements/Cells: 8000
Total RAM Bits: 387072
Number of I/O: 250
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BGA

库存7,776

EP1K50QC208-2N

Intel

IC FPGA 147 I/O 208QFP

Number of LABs/CLBs: 360
Number of Logic Elements/Cells: 2880
Total RAM Bits: 40960
Number of I/O: 147
Number of Gates: 199000
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封装: 208-BFQFP

库存4,960

EP1S10F672C6N

Intel

IC FPGA 345 I/O 672FBGA

Number of LABs/CLBs: 1057
Number of Logic Elements/Cells: 10570
Total RAM Bits: 920448
Number of I/O: 345
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA

库存7,296

EP20K200EFC484-2

Intel

IC FPGA 376 I/O 484FBGA

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 8320
Total RAM Bits: 106496
Number of I/O: 376
Number of Gates: 526000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封装: 484-BBGA

库存14,352

5SGXEABN2F45I3L

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 65561600
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封装: 1932-BBGA, FCBGA

库存5,392

5SGXEBBR2H43C2N

Intel

IC FPGA 600 I/O 1760HBGA

Number of LABs/CLBs: 359200
Number of Logic Elements/Cells: 952000
Total RAM Bits: 65561600
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-HBGA (45x45)

封装: 1760-BBGA, FCBGA

库存5,568

5SGSED8N2F45I3L

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 262400
Number of Logic Elements/Cells: 695000
Total RAM Bits: 60968960
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封装: 1932-BBGA, FCBGA

库存5,696

EP4SGX180FF35C4

Intel

IC FPGA 564 I/O 1152FBGA

Number of LABs/CLBs: 7030
Number of Logic Elements/Cells: 175750
Total RAM Bits: 13954048
Number of I/O: 564
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存4,512

5SGSMD3E2H29C2L

Intel

IC FPGA 360 I/O 780HBGA

Number of LABs/CLBs: 89000
Number of Logic Elements/Cells: 236000
Total RAM Bits: 16937984
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-HBGA (33x33)

封装: 780-BBGA, FCBGA

库存2,096

5SGXMA5N3F40C3N

Intel

IC FPGA 600 I/O 1517FBGA

Number of LABs/CLBs: 185000
Number of Logic Elements/Cells: 490000
Total RAM Bits: 53105664
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

库存5,456

EP3SL110F780I3N

Intel

IC FPGA 488 I/O 780FBGA

Number of LABs/CLBs: 4300
Number of Logic Elements/Cells: 107500
Total RAM Bits: 4992000
Number of I/O: 488
Number of Gates: -
Voltage - Supply: 0.86 V ~ 1.15 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

库存4,992

EP4CE40F29C7N

Intel

IC FPGA 532 I/O 780FBGA

Number of LABs/CLBs: 2475
Number of Logic Elements/Cells: 39600
Total RAM Bits: 1161216
Number of I/O: 532
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BGA

库存6,160

EP4CE30F29C9LN

Intel

IC FPGA 532 I/O 780FBGA

Number of LABs/CLBs: 1803
Number of Logic Elements/Cells: 28848
Total RAM Bits: 608256
Number of I/O: 532
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 780-BGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BGA

库存3,312

EPM7192EQC160-12YY

Intel

IC CPLD 192MC 12NS 160QFP

Programmable Type: EE PLD
Delay Time tpd(1) Max: 12.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 12
Number of Macrocells: 192
Number of Gates: 3750
Number of I/O: 124
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

封装: 160-BQFP

库存2,064

EPM7128SLC84-10

Intel

IC CPLD 128MC 10NS 84PLCC

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 128
Number of Gates: 2500
Number of I/O: 68
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.31x29.31)

封装: 84-LCC (J-Lead)

库存6,192

5AGTMC3D3F27I5G

Intel

IC FPGA 336 I/O 672FBGA

Number of LABs/CLBs: 7362
Number of Logic Elements/Cells: 156000
Total RAM Bits: 11746304
Number of I/O: 336
Number of Gates: -
Voltage - Supply: 1.07V ~ 1.13V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA, FCBGA

库存2,416

EP2S130F1020I5N

Intel

IC FPGA 742 I/O 1020FBGA

Number of LABs/CLBs: 6627
Number of Logic Elements/Cells: 132540
Total RAM Bits: -
Number of I/O: 742
Number of Gates: -
Voltage - Supply: 1.15V ~ 1.25V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1020-BBGA
Supplier Device Package: 1020-FBGA (33x33)

封装: -

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5SGSMD3H3F35C4WN

Intel

IC FPGA 432 I/O 1152FBGA

Number of LABs/CLBs: 89000
Number of Logic Elements/Cells: 236000
Total RAM Bits: 13312000
Number of I/O: 432
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: -

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1SD280PT3F55I3VGS1

Intel

IC FPGA 816 I/O 2912FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: 2753000
Total RAM Bits: 240123904
Number of I/O: 816
Number of Gates: -
Voltage - Supply: -
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2912-BBGA, FCBGA
Supplier Device Package: 2912-FBGA (55x55)

封装: -

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RK80532KE056512

Intel

IC MPU INTEL XEON 2.4GHZ 604PPGA

Core Processor: Intel® Xeon® Processor
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 2.4GHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V
Operating Temperature: 74°C (TC)
Security Features: -
Package / Case: 604-PGA
Supplier Device Package: 604-PPGA (42.5x42.5)

封装: -

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AGFB023R25A1I1V

Intel

IC FPGA AGILEX-F 2581FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

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5SGXEA7N1F45C1WN

Intel

IC FPGA 840 I/O 1932FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 840
Number of Gates: -
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封装: -

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AGFC019R25A3E3E

Intel

IC FPGA AGILEX-F 2581FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

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AGFA027R24C2I2V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

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EP4SGX360KF43C2G

Intel

IC FPGA 880 I/O 1760FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封装: -

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5SGSMD5K3F40I3LG

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 172600
Number of Logic Elements/Cells: 457000
Total RAM Bits: 39936000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: -

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EWIXP455BAC

Intel

IC MPU INTEL 400MHZ PBGA544

Core Processor: Intel® IXP45x
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: Mll (3), SMII (3)
SATA: -
USB: USB 1.1 (1), USB 2.0 (1)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: 3DES, AES, DES, MD5, RNG, SHA1
Package / Case: 544-BBGA
Supplier Device Package: 544-PBGA (35x35)

封装: -

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5SGXMA4K2F35I3LG

Intel

IC FPGA 600 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 37888000
Number of I/O: 600
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: -

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