Intel 产品

GT28F320C3BA110

Intel

IC FLASH 32MBIT 110NS 48UBGA

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH - Boot Block
• Memory Size: 32Mb (2M x 16)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 110ns
• Access Time: 110ns
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-VFBGA
• Supplier Device Package: 48-µBGA CSP

封装: 48-VFBGA

S87C5424SF76

Intel

IC MCU 8BIT 16KB OTP 44MQFP

• Core Processor: MCS 51
• Core Size: 8-Bit
• Speed: 24MHz
• Connectivity: SIO
• Peripherals: -
• Number of I/O: 32
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-QFP
• Supplier Device Package: -

封装: 44-QFP

5ASXFB5H4F40C6NES

Intel

IC FPGA 528 I/O 1517FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 700MHz
• Primary Attributes: FPGA - 462K Logic Elements
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

10AS057N3F40E2SG

Intel

IC SOC FPGA 588 I/O 1517FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 570K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

封装: 1517-BBGA, FCBGA

EPXA1F484C2

Intel

IC EXCALIBUR ARM 484FBGA

• Core Type: 32-Bit ARM9
• Speed: 200MHz
• Interface: EBI/EMI, UART/USART
• Program SRAM Bytes: 32K
• FPGA SRAM: -
• EEPROM Size: -
• Data SRAM Bytes: 16K
• FPGA Core Cells: 4160
• FPGA Gates: 100K
• FPGA Registers: -
• Voltage - Supply: 1.8V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

封装: 484-BBGA

HC20K600BC652

Intel

IC FPGA APEX 652BGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 24320
• Total RAM Bits: 311296
• Number of I/O: -
• Number of Gates: 600000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: -
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

10M02SCE144C7G

Intel

IC FPGA 101 I/O 144EQFP

• Number of LABs/CLBs: 125
• Number of Logic Elements/Cells: 2000
• Total RAM Bits: 110592
• Number of I/O: 101
• Number of Gates: -
• Voltage - Supply: 2.85 V ~ 3.465 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-EQFP (20x20)

封装: 144-LQFP Exposed Pad

10M08DAF484C7G

Intel

IC FPGA 250 I/O 484FBGA

• Number of LABs/CLBs: 500
• Number of Logic Elements/Cells: 8000
• Total RAM Bits: 387072
• Number of I/O: 250
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

封装: 484-BGA

EPF10K50VQC240-2

Intel

IC FPGA 189 I/O 240QFP

• Number of LABs/CLBs: 360
• Number of Logic Elements/Cells: 2880
• Total RAM Bits: 20480
• Number of I/O: 189
• Number of Gates: 116000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 240-BQFP
• Supplier Device Package: 240-PQFP (32x32)

封装: 240-BQFP

EP20K1000EBC652-2

Intel

IC FPGA 488 I/O 652BGA

• Number of LABs/CLBs: 3840
• Number of Logic Elements/Cells: 38400
• Total RAM Bits: 327680
• Number of I/O: 488
• Number of Gates: 1772000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 652-BBGA
• Supplier Device Package: 652-BGA (45x45)

封装: 652-BBGA

5SGTMC7K2F40I2N

Intel

IC FPGA 600 I/O 1517FBGA

• Number of LABs/CLBs: 234750
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 59938816
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

EPF10K50VBI356-4N

Intel

IC FPGA 274 I/O 356BGA

• Number of LABs/CLBs: 360
• Number of Logic Elements/Cells: 2880
• Total RAM Bits: 20480
• Number of I/O: 274
• Number of Gates: 116000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 356-LBGA
• Supplier Device Package: 356-BGA (35x35)

封装: 356-LBGA

EP1S40F1020C7N

Intel

IC FPGA 773 I/O 1020FBGA

• Number of LABs/CLBs: 4125
• Number of Logic Elements/Cells: 41250
• Total RAM Bits: 3423744
• Number of I/O: 773
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

封装: 1020-BBGA

EP1S30F780C5N

Intel

IC FPGA 597 I/O 780FBGA

• Number of LABs/CLBs: 3247
• Number of Logic Elements/Cells: 32470
• Total RAM Bits: 3317184
• Number of I/O: 597
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

EP1S20F780C6N

Intel

IC FPGA 586 I/O 780FBGA

• Number of LABs/CLBs: 1846
• Number of Logic Elements/Cells: 18460
• Total RAM Bits: 1669248
• Number of I/O: 586
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

5SGSMD5H3F35I3L

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 172600
• Number of Logic Elements/Cells: 457000
• Total RAM Bits: 46769152
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

5SGXMA5H2F35C2N

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 53105664
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

EP2S90F1508C3

Intel

IC FPGA 902 I/O 1508FBGA

• Number of LABs/CLBs: 4548
• Number of Logic Elements/Cells: 90960
• Total RAM Bits: 4520488
• Number of I/O: 902
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1508-BBGA, FCBGA
• Supplier Device Package: 1508-FBGA (30x30)

封装: 1508-BBGA, FCBGA

5AGZME5K2F40C3N

Intel

IC FPGA 674 I/O 1517FBGA

• Number of LABs/CLBs: 18870
• Number of Logic Elements/Cells: 400000
• Total RAM Bits: 34322432
• Number of I/O: 674
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

5AGXFB5H4F35I5N

Intel

IC FPGA 544 I/O 1152FBGA

• Number of LABs/CLBs: 19811
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 23625728
• Number of I/O: 544
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA Exposed Pad
• Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA Exposed Pad

EP1AGX60CF484I6N

Intel

IC FPGA 229 I/O 484FBGA

• Number of LABs/CLBs: 3005
• Number of Logic Elements/Cells: 60100
• Total RAM Bits: 2528640
• Number of I/O: 229
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

封装: 484-BBGA

EP3C55F484C7N

Intel

IC FPGA 327 I/O 484FBGA

• Number of LABs/CLBs: 3491
• Number of Logic Elements/Cells: 55856
• Total RAM Bits: 2396160
• Number of I/O: 327
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

封装: 484-BGA

EP4CE15E22C9LN

Intel

IC FPGA 81 I/O 144EQFP

• Number of LABs/CLBs: 963
• Number of Logic Elements/Cells: 15408
• Total RAM Bits: 516096
• Number of I/O: 81
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-EQFP (20x20)

封装: 144-LQFP Exposed Pad

EPM7160STC100-7N

Intel

IC CPLD 160MC 7.5NS 100TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 10
• Number of Macrocells: 160
• Number of Gates: 3200
• Number of I/O: 84
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

封装: 100-TQFP

EPM9560RC240-15

Intel

IC CPLD 560MC 15NS 240RQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 15.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 35
• Number of Macrocells: 560
• Number of Gates: 12000
• Number of I/O: 191
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-RQFP (32x32)

封装: 240-BFQFP Exposed Pad

5AGXBA5D4F35I5G

Intel

IC FPGA 544 I/O 1152FBGA

• Number of LABs/CLBs: 8962
• Number of Logic Elements/Cells: 190000
• Total RAM Bits: 13284352
• Number of I/O: 544
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

5SGXMB5R3F43I3LG

Intel

IC FPGA 600 I/O 1760FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 41984000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

封装: -

Request a Quote

5SGXMA7K2F35C1G

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封装: -

Request a Quote

AGIB022R31B2I3V

Intel

IC FPGA AGILEX-I 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.2M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

Request a Quote

5SGXMB9R2H43I2G

Intel

IC FPGA 600 I/O 1760HBGA

• Number of LABs/CLBs: 317000
• Number of Logic Elements/Cells: 840000
• Total RAM Bits: 53248000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-HBGA (45x45)

封装: -

Request a Quote