页 194 - Intel 产品 | 深圳黑森尔电子
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Intel 产品

记录 9,824
页  194/328
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10AS032E3F27E2LG
Intel

672-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 320K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存6,336
HC1S60F1020BY
Intel

IC FPGA APEX 1020FBGA

  • Number of LABs/CLBs: 5712
  • Number of Logic Elements/Cells: 57120
  • Total RAM Bits: 5215104
  • Number of I/O: 782
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -
  • Package / Case: 1020-BBGA
  • Supplier Device Package: 1020-FBGA (33x33)
封装: 1020-BBGA
库存4,384
10AX115U1F45I2SGES
Intel

IC FPGA 480 I/O 1932FCBGA

  • Number of LABs/CLBs: 427200
  • Number of Logic Elements/Cells: 1150000
  • Total RAM Bits: 68857856
  • Number of I/O: 480
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封装: 1932-BBGA, FCBGA
库存5,840
EP20K1000CF672C7
Intel

IC FPGA 508 I/O 672FBGA

  • Number of LABs/CLBs: 3840
  • Number of Logic Elements/Cells: 38400
  • Total RAM Bits: 327680
  • Number of I/O: 508
  • Number of Gates: 1772000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
封装: 672-BBGA, FCBGA
库存5,760
5SGXEB6R2F43I2N
Intel

IC FPGA 600 I/O 1760FBGA

  • Number of LABs/CLBs: 225400
  • Number of Logic Elements/Cells: 597000
  • Total RAM Bits: 61688832
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
封装: 1760-BBGA, FCBGA
库存5,712
5SGXMA7N3F45C3
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封装: 1932-BBGA, FCBGA
库存2,304
5SGSMD8N3F45C4N
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 60968960
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封装: 1932-BBGA, FCBGA
库存4,096
EP4SGX180DF29I3
Intel

IC FPGA 372 I/O 780FBGA

  • Number of LABs/CLBs: 7030
  • Number of Logic Elements/Cells: 175750
  • Total RAM Bits: 13954048
  • Number of I/O: 372
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封装: 780-BBGA, FCBGA
库存6,208
5AGXFB5K4F40I5
Intel

IC FPGA 704 I/O 1517FBGA

  • Number of LABs/CLBs: 19811
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 23625728
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA
库存2,976
5AGTMD3G3F31I3N
Intel

IC FPGA 384 I/O 896FBGA

  • Number of LABs/CLBs: 17110
  • Number of Logic Elements/Cells: 242000
  • Total RAM Bits: 19822592
  • Number of I/O: 384
  • Number of Gates: -
  • Voltage - Supply: 1.12 V ~ 1.18 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FBGA (31x31)
封装: 896-BBGA, FCBGA
库存3,136
EP1SGX40GF1020C7
Intel

IC FPGA 624 I/O 1020FBGA

  • Number of LABs/CLBs: 4125
  • Number of Logic Elements/Cells: 41250
  • Total RAM Bits: 3423744
  • Number of I/O: 624
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1020-BBGA
  • Supplier Device Package: 1020-FBGA (33x33)
封装: 1020-BBGA
库存2,832
5AGXMB3G4F31C5N
Intel

IC FPGA 384 I/O 896FBGA

  • Number of LABs/CLBs: 17110
  • Number of Logic Elements/Cells: 362000
  • Total RAM Bits: 19822592
  • Number of I/O: 384
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FBGA (31x31)
封装: 896-BBGA, FCBGA
库存3,808
EP2SGX60EF1152C5
Intel

IC FPGA 534 I/O 1152FBGA

  • Number of LABs/CLBs: 3022
  • Number of Logic Elements/Cells: 60440
  • Total RAM Bits: 2544192
  • Number of I/O: 534
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA
库存2,416
EP2S15F484I4
Intel

IC FPGA 342 I/O 484FBGA

  • Number of LABs/CLBs: 780
  • Number of Logic Elements/Cells: 15600
  • Total RAM Bits: 419328
  • Number of I/O: 342
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
封装: 484-BBGA
库存6,400
5CGTFD5C5F27C7N
Intel

IC FPGA 336 I/O 672FBGA

  • Number of LABs/CLBs: 29080
  • Number of Logic Elements/Cells: 77000
  • Total RAM Bits: 5001216
  • Number of I/O: 336
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BGA
  • Supplier Device Package: 672-FBGA (27x27)
封装: 672-BGA
库存4,400
hot EP3C55U484I7N
Intel

IC FPGA 327 I/O 484UBGA

  • Number of LABs/CLBs: 3491
  • Number of Logic Elements/Cells: 55856
  • Total RAM Bits: 2396160
  • Number of I/O: 327
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-FBGA
  • Supplier Device Package: 484-UBGA (19x19)
封装: 484-FBGA
库存5,648
hot EPM1270F256C3
Intel

IC CPLD 980MC 6.2NS 256FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.2ns
  • Voltage Supply - Internal: 2.5V, 3.3V
  • Number of Logic Elements/Blocks: 1270
  • Number of Macrocells: 980
  • Number of Gates: -
  • Number of I/O: 212
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封装: 256-BGA
库存5,232
5AGXMB3G4F40I5G
Intel

IC FPGA 704 I/O 1517FBGA

  • Number of LABs/CLBs: 17110
  • Number of Logic Elements/Cells: 362000
  • Total RAM Bits: 19822592
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 1.07V ~ 1.13V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存7,856
RU82566MM
Intel

IC TXRX FULL/HALF 1/1 81BGA

  • Type: Transceiver
  • Protocol: IEEE 802.3
  • Number of Drivers/Receivers: 1/1
  • Duplex: Full, Half
  • Receiver Hysteresis: 160 mV
  • Data Rate: 10Mbps, 100Mbps, 1Gbps
  • Voltage - Supply: 0.95V ~ 1.05V, 1.71V ~ 1.89V, 3V ~ 3.6V
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 81-BGA
  • Supplier Device Package: 81-BGA (10x10)
封装: -
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1SG280HN3F43E2VG
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 350000
  • Number of Logic Elements/Cells: 2800000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
封装: -
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5SGXEA9N3F45I4G
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 317000
  • Number of Logic Elements/Cells: 840000
  • Total RAM Bits: 53248000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封装: -
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5SGXEA5K2F40I2G
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: -
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AGFB023R25A3E4X
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
NG80960JF33
Intel

RISC MPU, 32-BIT, 33MHZ PQFP132

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
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5SGSMD3E2H29I3G
Intel

IC FPGA 360 I/O 780HBGA

  • Number of LABs/CLBs: 89000
  • Number of Logic Elements/Cells: 236000
  • Total RAM Bits: 13312000
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
封装: -
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5SGSMD5K3F40C3WN
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 172600
  • Number of Logic Elements/Cells: 457000
  • Total RAM Bits: 39936000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: -
Request a Quote
AGIB027R29A1I2V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2957-BFBGA Exposed Pad
  • Supplier Device Package: 2957-BGA (56x45)
封装: -
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5SGXMA5H1F35I2G
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: -
Request a Quote
5SGXMA4K2F35I2G
Intel

IC FPGA 600 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 37888000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: -
Request a Quote
5SGXEA7H3F35C3WN
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: -
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