页 173 - Intel 产品 | 深圳黑森尔电子
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Intel 产品

记录 9,824
页  173/328
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10AS032H2F35E2LG
Intel

1152-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 320K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存5,184
EPF8452ATC100-2
Intel

IC FPGA

  • Number of LABs/CLBs: 42
  • Number of Logic Elements/Cells: 336
  • Total RAM Bits: -
  • Number of I/O: 78
  • Number of Gates: 4000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
封装: 100-TQFP
库存2,336
hot EPF81188AQC240-3
Intel

IC FPGA 184 I/O 240QFP

  • Number of LABs/CLBs: 126
  • Number of Logic Elements/Cells: 1008
  • Total RAM Bits: -
  • Number of I/O: 184
  • Number of Gates: 12000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
封装: 240-BFQFP
库存6,432
hot EPF10K130EFC484-3
Intel

IC FPGA 369 I/O 484FBGA

  • Number of LABs/CLBs: 832
  • Number of Logic Elements/Cells: 6656
  • Total RAM Bits: 65536
  • Number of I/O: 369
  • Number of Gates: 342000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
封装: 484-BBGA
库存46,080
EP20K1000CF672C8
Intel

IC FPGA 508 I/O 672FBGA

  • Number of LABs/CLBs: 3840
  • Number of Logic Elements/Cells: 38400
  • Total RAM Bits: 327680
  • Number of I/O: 508
  • Number of Gates: 1772000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FBGA (27x27)
封装: 672-BBGA, FCBGA
库存3,216
EP1K10FC256-3N
Intel

IC FPGA 136 I/O 256FBGA

  • Number of LABs/CLBs: 72
  • Number of Logic Elements/Cells: 576
  • Total RAM Bits: 12288
  • Number of I/O: 136
  • Number of Gates: 56000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-FBGA (17x17)
封装: 256-BBGA
库存5,872
hot EP1S10F672C7N
Intel

IC FPGA 345 I/O 672FBGA

  • Number of LABs/CLBs: 1057
  • Number of Logic Elements/Cells: 10570
  • Total RAM Bits: 920448
  • Number of I/O: 345
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-BBGA
  • Supplier Device Package: 672-FBGA (27x27)
封装: 672-BBGA
库存6,096
EP3SL340F1760I4L
Intel

IC FPGA 1120 I/O 1760FBGA

  • Number of LABs/CLBs: 13500
  • Number of Logic Elements/Cells: 337500
  • Total RAM Bits: 18822144
  • Number of I/O: 1120
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
封装: 1760-BBGA, FCBGA
库存7,488
5SGXEA5H1F35C1N
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 53105664
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA
库存5,216
10AX090S3F45I2SG
Intel

IC FPGA 624 I/O 1932FCBGA

  • Number of LABs/CLBs: 339620
  • Number of Logic Elements/Cells: 900000
  • Total RAM Bits: 59234304
  • Number of I/O: 624
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封装: 1932-BBGA, FCBGA
库存6,496
5SGXEA3K3F35I3LN
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 23704576
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA
库存2,176
5SGXMA9K1H40I2N
Intel

IC FPGA 696 I/O 1517HBGA

  • Number of LABs/CLBs: 317000
  • Number of Logic Elements/Cells: 840000
  • Total RAM Bits: 64210944
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-HBGA (45x45)
封装: 1517-BBGA, FCBGA
库存6,768
5SGXEB6R3F40I3LN
Intel

IC FPGA 432 I/O 1517FBGA

  • Number of LABs/CLBs: 225400
  • Number of Logic Elements/Cells: 597000
  • Total RAM Bits: 61688832
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存7,888
5AGXFB3H4F35C5N
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 17110
  • Number of Logic Elements/Cells: 362000
  • Total RAM Bits: 19822592
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA Exposed Pad
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA Exposed Pad
库存2,832
EP1AGX35DF780I6N
Intel

IC FPGA 341 I/O 780FBGA

  • Number of LABs/CLBs: 1676
  • Number of Logic Elements/Cells: 33520
  • Total RAM Bits: 1348416
  • Number of I/O: 341
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA
  • Supplier Device Package: 780-FBGA (29x29)
封装: 780-BBGA
库存6,816
EPM7128BTC100-4N
Intel

IC CPLD 128MC 4NS 100TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 4.0ns
  • Voltage Supply - Internal: 2.375 V ~ 2.625 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 2500
  • Number of I/O: 84
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
封装: 100-TQFP
库存4,192
5SGXMA4H3F35C2G
Intel

IC FPGA 600 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 37888000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: -
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5SGXMBBR2H40I2LG
Intel

IC FPGA 696 I/O 1517HBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 53248000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-HBGA (45x45)
封装: -
Request a Quote
5SGSED8K2F40C2LG
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 51200000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: -
Request a Quote
AGFC023R24C2E1V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封装: -
Request a Quote
5SGSED8N3F45C3G
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 51200000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封装: -
Request a Quote
EP4SGX180KF40C4G
Intel

IC FPGA 744 I/O 1517FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
AGFA027R25A2I3V
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
1SX250HU1F50E1VG
Intel

IC FPGA STRATIX 10 2397FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2500K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
封装: -
Request a Quote
EPM240M100C5NAB
Intel

IC CPLD 192MC 7.5NS 100MBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5 ns
  • Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
  • Number of Logic Elements/Blocks: 240
  • Number of Macrocells: 192
  • Number of Gates: -
  • Number of I/O: 80
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TFBGA
  • Supplier Device Package: 100-MBGA (6x6)
封装: -
Request a Quote
5SGSMD5H3F35I3WN
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 172600
  • Number of Logic Elements/Cells: 457000
  • Total RAM Bits: 39936000
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: -
Request a Quote
EPM2210F324C4RR
Intel

IC CPLD 1700MC 9.1NS 324FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 9.1 ns
  • Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
  • Number of Logic Elements/Blocks: 2210
  • Number of Macrocells: 1700
  • Number of Gates: -
  • Number of I/O: 272
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 324-BGA
  • Supplier Device Package: 324-FBGA (19x19)
封装: -
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AGFA022R24C3E3V
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.2M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
5AGXMB5G4F35I5G
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 158491
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 23625728
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.07V ~ 1.13V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA, FC (35x35)
封装: -
Request a Quote
AGFD019R25A2I3V
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
封装: -
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