页 146 - Intel 产品 | 深圳黑森尔电子
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Intel 产品

记录 9,824
页  146/328
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10AS066K4F40I3SG
Intel

IC SOC FPGA 696 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 660K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存4,688
ER3125QI
Intel

IC REG BCK BST ADJ 2.5A SYNC QFN

  • Function: Step-Down, Step-Up/Step-Down
  • Output Configuration: Positive
  • Topology: Buck, Buck-Boost
  • Output Type: Adjustable
  • Number of Outputs: 1
  • Voltage - Input (Min): 3V
  • Voltage - Input (Max): 36V
  • Voltage - Output (Min/Fixed): 0.5V
  • Voltage - Output (Max): 36V
  • Current - Output: 2.5A
  • Frequency - Switching: 200kHz ~ 2.2MHz
  • Synchronous Rectifier: Both
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 20-VFQFN Exposed Pad
  • Supplier Device Package: 20-QFN-EP (4x4)
封装: 20-VFQFN Exposed Pad
库存3,600
EPC2XXA
Intel

IC FPGA FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存6,000
EP20K200EBC356-1N
Intel

IC FPGA 271 I/O 356BGA

  • Number of LABs/CLBs: 832
  • Number of Logic Elements/Cells: 8320
  • Total RAM Bits: 106496
  • Number of I/O: 271
  • Number of Gates: 526000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 356-LBGA
  • Supplier Device Package: 356-BGA (35x35)
封装: 356-LBGA
库存7,008
hot EPF10K10TC144-3N
Intel

IC FPGA 102 I/O 144TQFP

  • Number of LABs/CLBs: 72
  • Number of Logic Elements/Cells: 576
  • Total RAM Bits: 6144
  • Number of I/O: 102
  • Number of Gates: 31000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封装: 144-LQFP
库存5,424
hot EP1S80B956C6
Intel

IC FPGA 683 I/O 956BGA

  • Number of LABs/CLBs: 7904
  • Number of Logic Elements/Cells: 79040
  • Total RAM Bits: 7427520
  • Number of I/O: 683
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 956-BBGA, FCBGA
  • Supplier Device Package: 956-BGA (40x40)
封装: 956-BBGA, FCBGA
库存6,176
EP4CGX30BF14C8N
Intel

IC FPGA 72 I/O 169FBGA

  • Number of LABs/CLBs: 1840
  • Number of Logic Elements/Cells: 29440
  • Total RAM Bits: 1105920
  • Number of I/O: 72
  • Number of Gates: -
  • Voltage - Supply: 1.16 V ~ 1.24 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 169-LBGA
  • Supplier Device Package: 169-FBGA (14x14)
封装: 169-LBGA
库存5,680
5SGTMC7K2F40C1N
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 234750
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59938816
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存3,008
5SGXMB6R2F40I3LN
Intel

IC FPGA 432 I/O 1517FBGA

  • Number of LABs/CLBs: 225400
  • Number of Logic Elements/Cells: 597000
  • Total RAM Bits: 61688832
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存5,376
EP4SE360H29C3
Intel

IC FPGA 488 I/O 780HBGA

  • Number of LABs/CLBs: 14144
  • Number of Logic Elements/Cells: 353600
  • Total RAM Bits: 23105536
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
封装: 780-BBGA, FCBGA
库存3,264
10AX115N4F40I3LG
Intel

IC FPGA 600 I/O 1517FCBGA

  • Number of LABs/CLBs: 427200
  • Number of Logic Elements/Cells: 1150000
  • Total RAM Bits: 68857856
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
封装: 1517-BBGA, FCBGA
库存5,840
5SGSMD4K2F40I3L
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 135840
  • Number of Logic Elements/Cells: 360000
  • Total RAM Bits: 23946240
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存5,008
5AGXFB3H4F40C4N
Intel

IC FPGA 704 I/O 1517FBGA

  • Number of LABs/CLBs: 17110
  • Number of Logic Elements/Cells: 362000
  • Total RAM Bits: 19822592
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA
库存3,792
5AGXBB3D4F35I5G
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 17110
  • Number of Logic Elements/Cells: 362000
  • Total RAM Bits: 19822592
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA Exposed Pad
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA Exposed Pad
库存2,144
EP3SE50F780I4LN
Intel

IC FPGA 488 I/O 780FBGA

  • Number of LABs/CLBs: 1900
  • Number of Logic Elements/Cells: 47500
  • Total RAM Bits: 5760000
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封装: 780-BBGA, FCBGA
库存5,712
EP4CE115F23I8L
Intel

IC FPGA 280 I/O 484FBGA

  • Number of LABs/CLBs: 7155
  • Number of Logic Elements/Cells: 114480
  • Total RAM Bits: 3981312
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
封装: 484-BGA
库存2,336
10CX105YU484I5G
Intel

484-PIN UBGA

  • Number of LABs/CLBs: 38000
  • Number of Logic Elements/Cells: 104000
  • Total RAM Bits: 8641536
  • Number of I/O: 188
  • Number of Gates: -
  • Voltage - Supply: 0.9V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BFBGA, FCBGA
  • Supplier Device Package: 484-UBGA (19x19)
封装: 484-BFBGA, FCBGA
库存6,192
10M08SCM153I7G
Intel

IC FPGA 112 I/O 153MBGA

  • Number of LABs/CLBs: 500
  • Number of Logic Elements/Cells: 8000
  • Total RAM Bits: 387072
  • Number of I/O: 112
  • Number of Gates: -
  • Voltage - Supply: 2.85 V ~ 3.465 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 153-VFBGA
  • Supplier Device Package: 153-MBGA (8x8)
封装: 153-VFBGA
库存23,580
EPM2210GF324C5
Intel

IC CPLD 1700MC 7NS 324FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.0ns
  • Voltage Supply - Internal: 1.71 V ~ 1.89 V
  • Number of Logic Elements/Blocks: 2210
  • Number of Macrocells: 1700
  • Number of Gates: -
  • Number of I/O: 272
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 324-BGA
  • Supplier Device Package: 324-FBGA (19x19)
封装: 324-BGA
库存5,904
5AGXMB3G6F35C6G
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 17110
  • Number of Logic Elements/Cells: 362000
  • Total RAM Bits: 19822592
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.07V ~ 1.13V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: 1152-BBGA, FCBGA
库存6,944
AGFB006R24C2I2VB
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 573K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封装: -
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5SGXEA5K3F35C2G
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封装: -
Request a Quote
5SGXMA5N2F40I3LG
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: -
Request a Quote
MD51C67-45-B
Intel

DUAL MARKED (8413202RA)

  • Memory Type: -
  • Memory Format: -
  • Technology: -
  • Memory Size: -
  • Memory Interface: -
  • Clock Frequency: -
  • Write Cycle Time - Word, Page: -
  • Access Time: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
AGFB019R31C3E3V
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
封装: -
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EPM1270F256C4NRR
Intel

IC CPLD 980MC 8.1NS 256FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 8.1 ns
  • Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
  • Number of Logic Elements/Blocks: 1270
  • Number of Macrocells: 980
  • Number of Gates: -
  • Number of I/O: 212
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封装: -
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AGFB014R24C2I2VB
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.4M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封装: -
Request a Quote
1SX280HH3F55E3XG
Intel

IC FPGA STRATIX 10 2912FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2800K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2912-BBGA, FCBGA
  • Supplier Device Package: 2912-FBGA, FC (55x55)
封装: -
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10M50DDF256I7G
Intel

IC FPGA/CPLD NV 178 I/O 256FBGA

  • Number of LABs/CLBs: 3125
  • Number of Logic Elements/Cells: 50000
  • Total RAM Bits: 1677312
  • Number of I/O: 178
  • Number of Gates: -
  • Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
封装: -
库存270
NE80546QG0882MM
Intel

IC MPU INTEL XEON 3.2GHZ 604PPGA

  • Core Processor: Intel® Xeon® Processor
  • Number of Cores/Bus Width: 1 Core, 64-Bit
  • Speed: 3.2GHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.25V, 1.388V
  • Operating Temperature: 72°C (TC)
  • Security Features: -
  • Package / Case: 604-PGA
  • Supplier Device Package: 604-PPGA (42.5x42.5)
封装: -
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