页 117 - Intel 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
10AS022E3F27E1HG	Intel	IC SOC FPGA 240 I/O 672FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 220K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BBGA, FCBGA	库存4,800
10AS022C4U19E3LG	Intel	484-PIN UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 220K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存6,912
EPC2TI32	Intel	IC CONFIG DEVICE 1.6MBIT 32TQFP Programmable Type: In System Programmable Memory Size: 1.6Mb Voltage - Supply: 3 V ~ 3.6 V, 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Package / Case: 32-TQFP Supplier Device Package: 32-TQFP (7x7)	封装: 32-TQFP	库存5,888
HC1S40F780NAL	Intel	IC FPGA APEX 780FBGA Number of LABs/CLBs: 4125 Number of Logic Elements/Cells: 41250 Total RAM Bits: 2244096 Number of I/O: 613 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: - Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BBGA, FCBGA	库存2,752
EP20K600EFC672-1XN	Intel	IC FPGA 508 I/O 672FBGA Number of LABs/CLBs: 2432 Number of Logic Elements/Cells: 24320 Total RAM Bits: 311296 Number of I/O: 508 Number of Gates: 1537000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BBGA	库存5,392
EP20K200EQC240-3N	Intel	IC FPGA 168 I/O 240QFP Number of LABs/CLBs: 832 Number of Logic Elements/Cells: 8320 Total RAM Bits: 106496 Number of I/O: 168 Number of Gates: 526000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BQFP Supplier Device Package: 240-PQFP (32x32)	封装: 240-BQFP	库存2,128
EP2S180F1508C3N	Intel	IC FPGA 1170 I/O 1508FBGA Number of LABs/CLBs: 8970 Number of Logic Elements/Cells: 179400 Total RAM Bits: 9383040 Number of I/O: 1170 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1508-BBGA, FCBGA Supplier Device Package: 1508-FBGA (30x30)	封装: 1508-BBGA, FCBGA	库存6,432
EP4SGX290NF45I4N	Intel	IC FPGA 920 I/O 1932FBGA Number of LABs/CLBs: 11648 Number of Logic Elements/Cells: 291200 Total RAM Bits: 17661952 Number of I/O: 920 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: 1932-BBGA, FCBGA	库存3,168
10AX115U2F45E2SG	Intel	IC FPGA 480 I/O 1932FCBGA Number of LABs/CLBs: 427200 Number of Logic Elements/Cells: 1150000 Total RAM Bits: 68857856 Number of I/O: 480 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.98 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45x45)	封装: 1932-BBGA, FCBGA	库存3,152
5SGXEA4H2F35C3N	Intel	IC FPGA 552 I/O 1152FBGA Number of LABs/CLBs: 158500 Number of Logic Elements/Cells: 420000 Total RAM Bits: 43983872 Number of I/O: 552 Number of Gates: - Voltage - Supply: 0.82 V ~ 0.88 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存4,128
EP2AGX65DF29I5G	Intel	IC FPGA 364 I/O 780FBGA Number of LABs/CLBs: 2530 Number of Logic Elements/Cells: 60214 Total RAM Bits: 5371904 Number of I/O: 364 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BBGA, FCBGA	库存2,384
EP2AGX45DF29I3N	Intel	IC FPGA 364 I/O 780FBGA Number of LABs/CLBs: 1805 Number of Logic Elements/Cells: 42959 Total RAM Bits: 3517440 Number of I/O: 364 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BBGA, FCBGA	库存13,656
5CGXFC9A6U19C7N	Intel	IC FPGA 240 I/O 484UBGA Number of LABs/CLBs: 113560 Number of Logic Elements/Cells: 301000 Total RAM Bits: 14251008 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.07 V ~ 1.13 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	封装: 484-FBGA	库存7,488
EP2C50U484C6N	Intel	IC FPGA 294 I/O 484UBGA Number of LABs/CLBs: 3158 Number of Logic Elements/Cells: 50528 Total RAM Bits: 594432 Number of I/O: 294 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	封装: 484-FBGA	库存74,904
EP2S15F672C5N	Intel	IC FPGA 366 I/O 672FBGA Number of LABs/CLBs: 780 Number of Logic Elements/Cells: 15600 Total RAM Bits: 419328 Number of I/O: 366 Number of Gates: - Voltage - Supply: 1.15 V ~ 1.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BBGA, FCBGA	库存4,896
5M40ZM64C5N	Intel	IC CPLD 32MC 7.5NS 64MBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 1.71 V ~ 1.89 V Number of Logic Elements/Blocks: 40 Number of Macrocells: 32 Number of Gates: - Number of I/O: 30 Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 64-TFBGA Supplier Device Package: 64-MBGA (4.5x4.5)	封装: 64-TFBGA	库存7,920
GT28F800B3T110	Intel	IC FLASH 8MBIT CUI 48UBGA Memory Type: Non-Volatile Memory Format: FLASH Technology: FLASH - Boot Block Memory Size: 8Mbit Memory Interface: CUI Clock Frequency: - Write Cycle Time - Word, Page: - Access Time: 110 ns Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFBGA Supplier Device Package: 48-uBGA (7.7x9)	封装: -	Request a Quote
1SD280PT2F55I1VG	Intel	IC FPGA 816 I/O 2912FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: 2753000 Total RAM Bits: 240123904 Number of I/O: 816 Number of Gates: - Voltage - Supply: - Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2912-BBGA, FCBGA Supplier Device Package: 2912-FBGA (55x55)	封装: -	Request a Quote
AGFB027R24C3E3V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
MD2114AL3	Intel	IC SRAM 4KBIT PARALLEL 18CDIP Memory Type: Volatile Memory Format: SRAM Technology: SRAM - Asynchronous Memory Size: 4Kbit Memory Interface: Parallel Clock Frequency: - Write Cycle Time - Word, Page: 150ns Access Time: 150 ns Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 18-CDIP Supplier Device Package: 18-CDIP	封装: -	Request a Quote
EP4SGX180HF35C4G	Intel	IC FPGA 564 I/O 1152FBGA Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
5AGXFB5K4F40I3G	Intel	IC FPGA 704 I/O 1517FBGA Number of LABs/CLBs: 158491 Number of Logic Elements/Cells: 420000 Total RAM Bits: 23625728 Number of I/O: 704 Number of Gates: - Voltage - Supply: 1.12V ~ 1.18V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA, FC (40x40)	封装: -	Request a Quote
AGIB023R18A2E3V	Intel	IC FPGA AGILEX-I 1805FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
UG80960HD8016	Intel	RISC MICROCONTROLLER, 32BIT, I96 Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
10M04SCU324I7G	Intel	IC FPGA 246 I/O 324UBGA Number of LABs/CLBs: 250 Number of Logic Elements/Cells: 4000 Total RAM Bits: 193536 Number of I/O: 246 Number of Gates: - Voltage - Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 324-LFBGA Supplier Device Package: 324-UBGA (15x15)	封装: -	库存327
5SGXMA7K2F40I3W	Intel	IC FPGA 696 I/O 1517FBGA Number of LABs/CLBs: 234720 Number of Logic Elements/Cells: 622000 Total RAM Bits: 51200000 Number of I/O: 696 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封装: -	Request a Quote
AGIA040R39A1I1VB	Intel	IC FPGA AGILEX-I 3948FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 4.047M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3948-BFBGA Exposed Pad Supplier Device Package: 3948-BGA (56x56)	封装: -	Request a Quote
NG82357	Intel	IC INTEG SYST PERIPHERAL 132QFP Type: Integrated System Peripheral Applications: - Mounting Type: Surface Mount Package / Case: 132-QFP Supplier Device Package: 132-PQFP	封装: -	Request a Quote
5AGZME7H3F35I4G	Intel	IC FPGA 534 I/O 1152FBGA Number of LABs/CLBs: 21225 Number of Logic Elements/Cells: 450000 Total RAM Bits: 40249344 Number of I/O: 534 Number of Gates: - Voltage - Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: -	Request a Quote
AGFD019R25A2E3V	Intel	IC FPGA AGILEX-F 2581FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	Request a Quote

10AS022E3F27E1HG

Intel

IC SOC FPGA 240 I/O 672FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 220K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA, FCBGA

库存4,800

10AS022C4U19E3LG

Intel

484-PIN UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 220K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存6,912

EPC2TI32

Intel

IC CONFIG DEVICE 1.6MBIT 32TQFP

Programmable Type: In System Programmable
Memory Size: 1.6Mb
Voltage - Supply: 3 V ~ 3.6 V, 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 32-TQFP
Supplier Device Package: 32-TQFP (7x7)

封装: 32-TQFP

库存5,888

HC1S40F780NAL

Intel

IC FPGA APEX 780FBGA

Number of LABs/CLBs: 4125
Number of Logic Elements/Cells: 41250
Total RAM Bits: 2244096
Number of I/O: 613
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

库存2,752

EP20K600EFC672-1XN

Intel

IC FPGA 508 I/O 672FBGA

Number of LABs/CLBs: 2432
Number of Logic Elements/Cells: 24320
Total RAM Bits: 311296
Number of I/O: 508
Number of Gates: 1537000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA

库存5,392

EP20K200EQC240-3N

Intel

IC FPGA 168 I/O 240QFP

Number of LABs/CLBs: 832
Number of Logic Elements/Cells: 8320
Total RAM Bits: 106496
Number of I/O: 168
Number of Gates: 526000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BQFP
Supplier Device Package: 240-PQFP (32x32)

封装: 240-BQFP

库存2,128

EP2S180F1508C3N

Intel

IC FPGA 1170 I/O 1508FBGA

Number of LABs/CLBs: 8970
Number of Logic Elements/Cells: 179400
Total RAM Bits: 9383040
Number of I/O: 1170
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1508-BBGA, FCBGA
Supplier Device Package: 1508-FBGA (30x30)

封装: 1508-BBGA, FCBGA

库存6,432

EP4SGX290NF45I4N

Intel

IC FPGA 920 I/O 1932FBGA

Number of LABs/CLBs: 11648
Number of Logic Elements/Cells: 291200
Total RAM Bits: 17661952
Number of I/O: 920
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封装: 1932-BBGA, FCBGA

库存3,168

10AX115U2F45E2SG

Intel

IC FPGA 480 I/O 1932FCBGA

Number of LABs/CLBs: 427200
Number of Logic Elements/Cells: 1150000
Total RAM Bits: 68857856
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.98 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1932-BBGA, FCBGA
Supplier Device Package: 1932-FBGA, FC (45x45)

封装: 1932-BBGA, FCBGA

库存3,152

5SGXEA4H2F35C3N

Intel

IC FPGA 552 I/O 1152FBGA

Number of LABs/CLBs: 158500
Number of Logic Elements/Cells: 420000
Total RAM Bits: 43983872
Number of I/O: 552
Number of Gates: -
Voltage - Supply: 0.82 V ~ 0.88 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存4,128

EP2AGX65DF29I5G

Intel

IC FPGA 364 I/O 780FBGA

Number of LABs/CLBs: 2530
Number of Logic Elements/Cells: 60214
Total RAM Bits: 5371904
Number of I/O: 364
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

库存2,384

EP2AGX45DF29I3N

Intel

IC FPGA 364 I/O 780FBGA

Number of LABs/CLBs: 1805
Number of Logic Elements/Cells: 42959
Total RAM Bits: 3517440
Number of I/O: 364
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

库存13,656

5CGXFC9A6U19C7N

Intel

IC FPGA 240 I/O 484UBGA

Number of LABs/CLBs: 113560
Number of Logic Elements/Cells: 301000
Total RAM Bits: 14251008
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 1.07 V ~ 1.13 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

封装: 484-FBGA

库存7,488

EP2C50U484C6N

Intel

IC FPGA 294 I/O 484UBGA

Number of LABs/CLBs: 3158
Number of Logic Elements/Cells: 50528
Total RAM Bits: 594432
Number of I/O: 294
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

封装: 484-FBGA

库存74,904

EP2S15F672C5N

Intel

IC FPGA 366 I/O 672FBGA

Number of LABs/CLBs: 780
Number of Logic Elements/Cells: 15600
Total RAM Bits: 419328
Number of I/O: 366
Number of Gates: -
Voltage - Supply: 1.15 V ~ 1.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA, FCBGA

库存4,896

5M40ZM64C5N

Intel

IC CPLD 32MC 7.5NS 64MBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 1.71 V ~ 1.89 V
Number of Logic Elements/Blocks: 40
Number of Macrocells: 32
Number of Gates: -
Number of I/O: 30
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 64-TFBGA
Supplier Device Package: 64-MBGA (4.5x4.5)

封装: 64-TFBGA

库存7,920

GT28F800B3T110

Intel

IC FLASH 8MBIT CUI 48UBGA

Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - Boot Block
Memory Size: 8Mbit
Memory Interface: CUI
Clock Frequency: -
Write Cycle Time - Word, Page: -
Access Time: 110 ns
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFBGA
Supplier Device Package: 48-uBGA (7.7x9)

封装: -

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1SD280PT2F55I1VG

Intel

IC FPGA 816 I/O 2912FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: 2753000
Total RAM Bits: 240123904
Number of I/O: 816
Number of Gates: -
Voltage - Supply: -
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2912-BBGA, FCBGA
Supplier Device Package: 2912-FBGA (55x55)

封装: -

Request a Quote

AGFB027R24C3E3V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

Request a Quote

MD2114AL3

Intel

IC SRAM 4KBIT PARALLEL 18CDIP

Memory Type: Volatile
Memory Format: SRAM
Technology: SRAM - Asynchronous
Memory Size: 4Kbit
Memory Interface: Parallel
Clock Frequency: -
Write Cycle Time - Word, Page: 150ns
Access Time: 150 ns
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -55°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 18-CDIP
Supplier Device Package: 18-CDIP

封装: -

Request a Quote

EP4SGX180HF35C4G

Intel

IC FPGA 564 I/O 1152FBGA

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封装: -

Request a Quote

5AGXFB5K4F40I3G

Intel

IC FPGA 704 I/O 1517FBGA

Number of LABs/CLBs: 158491
Number of Logic Elements/Cells: 420000
Total RAM Bits: 23625728
Number of I/O: 704
Number of Gates: -
Voltage - Supply: 1.12V ~ 1.18V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA, FC (40x40)

封装: -

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AGIB023R18A2E3V

Intel

IC FPGA AGILEX-I 1805FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

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UG80960HD8016

Intel

RISC MICROCONTROLLER, 32BIT, I96

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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10M04SCU324I7G

Intel

IC FPGA 246 I/O 324UBGA

Number of LABs/CLBs: 250
Number of Logic Elements/Cells: 4000
Total RAM Bits: 193536
Number of I/O: 246
Number of Gates: -
Voltage - Supply: 1.15V ~ 1.25V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 324-LFBGA
Supplier Device Package: 324-UBGA (15x15)

封装: -

库存327

5SGXMA7K2F40I3W

Intel

IC FPGA 696 I/O 1517FBGA

Number of LABs/CLBs: 234720
Number of Logic Elements/Cells: 622000
Total RAM Bits: 51200000
Number of I/O: 696
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: -

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AGIA040R39A1I1VB

Intel

IC FPGA AGILEX-I 3948FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 4.047M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 3948-BFBGA Exposed Pad
Supplier Device Package: 3948-BGA (56x56)

封装: -

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NG82357

Intel

IC INTEG SYST PERIPHERAL 132QFP

Type: Integrated System Peripheral
Applications: -
Mounting Type: Surface Mount
Package / Case: 132-QFP
Supplier Device Package: 132-PQFP

封装: -

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5AGZME7H3F35I4G

Intel

IC FPGA 534 I/O 1152FBGA

Number of LABs/CLBs: 21225
Number of Logic Elements/Cells: 450000
Total RAM Bits: 40249344
Number of I/O: 534
Number of Gates: -
Voltage - Supply: 0.82V ~ 0.88V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: -

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AGFD019R25A2E3V

Intel

IC FPGA AGILEX-F 2581FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

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