页 88 - 专用 IC | 集成电路（IC） | 深圳黑森尔电子
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专用 IC

记录 2,935
页  88/98
图片
零件编号
制造商
描述
封装
库存
数量
Applications
Mounting Type
Package / Case
Supplier Device Package
HA4344BCBZ96
Intersil

IC SWITCH CROSS VIDEO 4:1 16SOIC

  • Type: Crosspoint Switch
  • Applications: Video
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SOIC
封装: 16-SOIC (0.154", 3.90mm Width)
库存2,304
Video
Surface Mount
16-SOIC (0.154", 3.90mm Width)
16-SOIC
TDA3653B/N2,112
NXP

IC VERT DEFLECT 9-SIL

  • Type: -
  • Applications: -
  • Mounting Type: Surface Mount
  • Package / Case: 9-SIP Exposed Tab
  • Supplier Device Package: 9-SIL MPF
封装: 9-SIP Exposed Tab
库存7,024
-
Surface Mount
9-SIP Exposed Tab
9-SIL MPF
TDA8351/N6,112
NXP

IC DC COUPLED V-DEFL 9-SIL

  • Type: -
  • Applications: -
  • Mounting Type: Through Hole
  • Package / Case: 9-SIP
  • Supplier Device Package: 9-SIL
封装: 9-SIP
库存7,872
-
Through Hole
9-SIP
9-SIL
TSI578A-10GILV
IDT, Integrated Device Technology Inc

IC SWITCH RIO

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存7,456
-
-
-
-
80HCPS1616CHMG
IDT, Integrated Device Technology Inc

IC RIO SWITCH GEN2 400FCBGA

  • Type: Serial RapidIO? Switch
  • Applications: Wireless Infrastructure
  • Mounting Type: Surface Mount
  • Package / Case: 400-BBGA, FCBGA
  • Supplier Device Package: 400-FBGA (21x21)
封装: 400-BBGA, FCBGA
库存6,192
Wireless Infrastructure
Surface Mount
400-BBGA, FCBGA
400-FBGA (21x21)
AD9963BCPZRL
Analog Devices Inc.

IC DAC DUAL 16BIT 72LFCSP

  • Type: Broadband Front-End
  • Applications: Wireless Networking
  • Mounting Type: Surface Mount
  • Package / Case: 72-VFQFN Exposed Pad, CSP
  • Supplier Device Package: 72-LFCSP-VQ (10x10)
封装: 72-VFQFN Exposed Pad, CSP
库存4,336
Wireless Networking
Surface Mount
72-VFQFN Exposed Pad, CSP
72-LFCSP-VQ (10x10)
AD9941BSTZ
Analog Devices Inc.

IC PROCESSOR SIGNAL 14BIT 48LQFP

  • Type: Imaging Signal Processor
  • Applications: Digital Camera
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
封装: 48-LQFP
库存5,696
Digital Camera
Surface Mount
48-LQFP
48-LQFP (7x7)
CAP016DG-TL
Power Integrations

IC CAPZERO 1000V 2000NF 8-SOIC

  • Type: Capacitor Discharge
  • Applications: Converter, ACDC
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
封装: 8-SOIC (0.154", 3.90mm Width)
库存3,344
Converter, ACDC
Surface Mount
8-SOIC (0.154", 3.90mm Width)
8-SO
MCP2036T-I/SL
Microchip Technology

IC KEYLESS ENTRY AFE 14-SOIC

  • Type: Sensor Interface
  • Applications: Analog I/O
  • Mounting Type: Surface Mount
  • Package / Case: 14-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 14-SOIC
封装: 14-SOIC (0.154", 3.90mm Width)
库存4,672
Analog I/O
Surface Mount
14-SOIC (0.154", 3.90mm Width)
14-SOIC
DS2411P+T&R
Maxim Integrated

IC SILICON SERIAL NUMBER 6TSOC

  • Type: Silicon Serial Number
  • Applications: PCB, Network Node, Equipment Identification/Registration
  • Mounting Type: Surface Mount
  • Package / Case: 6-LSOJ (0.148", 3.76mm Width)
  • Supplier Device Package: 6-TSOC
封装: 6-LSOJ (0.148", 3.76mm Width)
库存6,000
PCB, Network Node, Equipment Identification/Registration
Surface Mount
6-LSOJ (0.148", 3.76mm Width)
6-TSOC
DLP230GPAFQP
Texas Instruments

IC DLP CTLR DLP2010

  • Type: Digital Micromirror Device (DMD)
  • Applications: -
  • Mounting Type: Surface Mount
  • Package / Case: -
  • Supplier Device Package: 54-CLGA (16.8x5.92)
封装: -
库存5,600
-
Surface Mount
-
54-CLGA (16.8x5.92)
MAX4944ELA+TGC7
Maxim Integrated

INTEGRATED CIRCUIT

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存6,080
-
-
-
-
BCM7583TPKFEBA01G
Broadcom Limited

SOC SET TOP BOX IC

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存6,704
-
-
-
-
BCM75835NCKFEBA03G
Broadcom Limited

SOC SET TOP BOX IC

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存4,784
-
-
-
-
BCM75831ZZKFEB03G
Broadcom Limited

SOC SET TOP BOX IC

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
库存2,928
-
-
-
-
DS2476Q+U
Maxim Integrated

IC SECURITY COMPANION CHIP 6TDFN

  • Type: Security Companion Chip
  • Applications: Networking and Communications
  • Mounting Type: Surface Mount
  • Package / Case: 6-WDFN Exposed Pad
  • Supplier Device Package: 6-TDFN (3x3)
封装: 6-WDFN Exposed Pad
库存6,176
Networking and Communications
Surface Mount
6-WDFN Exposed Pad
6-TDFN (3x3)
ST2100TR
STMicroelectronics

IC BROADBAND FRONT-END 373TFBGA

  • Type: Broadband Front-End
  • Applications: Power Line Communications
  • Mounting Type: Surface Mount
  • Package / Case: 373-TFBGA
  • Supplier Device Package: 373-TFBGA (12x12)
封装: 373-TFBGA
库存7,920
Power Line Communications
Surface Mount
373-TFBGA
373-TFBGA (12x12)
LTC4331IUFD#PBF
Linear Technology

I2C SLAVE EXTEND OVER DIFFERENTI

  • Type: Differential Link
  • Applications: Industrial, Lighting
  • Mounting Type: Surface Mount
  • Package / Case: 20-WFQFN Exposed Pad
  • Supplier Device Package: 20-QFN (5x4)
封装: 20-WFQFN Exposed Pad
库存2,848
Industrial, Lighting
Surface Mount
20-WFQFN Exposed Pad
20-QFN (5x4)
DS28E83Q+U
Maxim Integrated

IC AUTHENTICATION CHIP 6TDFN

  • Type: Authentication Chip
  • Applications: Medical
  • Mounting Type: Surface Mount
  • Package / Case: 6-WDFN Exposed Pad
  • Supplier Device Package: 6-TDFN-EP (3x3)
封装: 6-WDFN Exposed Pad
库存6,792
Medical
Surface Mount
6-WDFN Exposed Pad
6-TDFN-EP (3x3)
GS1514-CKD
Gennum

IC SERIAL DIG DC RESTORER 16SOIC

  • Type: Serial Digital DC Restorer
  • Applications: -
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SOIC
封装: -
Request a Quote
-
Surface Mount
16-SOIC (0.154", 3.90mm Width)
16-SOIC
090-03240-003
Microchip Technology

IC EMBEDDED ATOMIC CLK

  • Type: Embedded Atomic Clocks
  • Applications: -
  • Mounting Type: Through Hole
  • Package / Case: 12-DIP Module, 9 Leads
  • Supplier Device Package: -
封装: -
Request a Quote
-
Through Hole
12-DIP Module, 9 Leads
-
DLP800REA0FYV
Texas Instruments

IC DIG MICROMIRROR DEV 350CPGA

  • Type: Digital Micromirror Device (DMD)
  • Applications: -
  • Mounting Type: Through Hole
  • Package / Case: 350-BFCPGA
  • Supplier Device Package: 350-CPGA (35x32.2)
封装: -
Request a Quote
-
Through Hole
350-BFCPGA
350-CPGA (35x32.2)
MAX22516AWO-T
Analog Devices Inc./Maxim Integrated

IC

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
-
-
-
-
STSAFA110DFSPL02
STMicroelectronics

IC AUTHENTICAT CHIP/IOT 8UFDFPN

  • Type: Authentication Chip, IoT Secure Element
  • Applications: -
  • Mounting Type: Surface Mount
  • Package / Case: 8-UFDFN Exposed Pad
  • Supplier Device Package: 8-UFDFPN (2x3)
封装: -
库存15,528
-
Surface Mount
8-UFDFN Exposed Pad
8-UFDFPN (2x3)
VT225FCR-ADJ
Analog Devices Inc./Maxim Integrated

VT225FCR-ADJ

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
-
-
-
-
HFA3824IV96
Harris Corporation

IC SPREAD SPECT PROC 48TQFP

  • Type: Direct Sequence Spread Spectrum Baseband Processor
  • Applications: -
  • Mounting Type: Surface Mount
  • Package / Case: 48-TQFP
  • Supplier Device Package: 48-TQFP (7x7)
封装: -
Request a Quote
-
Surface Mount
48-TQFP
48-TQFP (7x7)
DS24L65Q-U
Analog Devices Inc./Maxim Integrated

IC AUTHENTICATION CHIP 6TDFN

  • Type: Authentication Chip
  • Applications: -
  • Mounting Type: Surface Mount
  • Package / Case: 6-WDFN Exposed Pad
  • Supplier Device Package: 6-TDFN (3x3)
封装: -
Request a Quote
-
Surface Mount
6-WDFN Exposed Pad
6-TDFN (3x3)
LS7084N
LSI/CSI

IC CLOCK CONVERTER 8DIP

  • Type: Clock Converter
  • Applications: Interface
  • Mounting Type: Through Hole
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-DIP
封装: -
Request a Quote
Interface
Through Hole
8-DIP (0.300", 7.62mm)
8-DIP
ATECC608C-SSHCZ-T
Microchip Technology

ECC/ECDH, SWI, SOIC T/R

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
-
-
-
-
HD6473847RFV
Renesas Electronics Corporation

HD6473847 - H8/300L SLP MICROCON

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
-
-
-
-