图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
IC SDRAM 16GBIT 800MHZ FBGA
|
封装: - |
库存3,872 |
|
DRAM | SDRAM - Mobile LPDDR3 | 16Gb (256M x 64) | Parallel | 800MHz | - | - | 1.14 V ~ 1.95 V | -30°C ~ 85°C (TC) | - | - | - |
||
Cypress Semiconductor Corp |
IC FRAM 128KBIT 40MHZ 8SOIC
|
封装: 8-SOIC (0.154", 3.90mm Width) |
库存12,144 |
|
FRAM | FRAM (Ferroelectric RAM) | 128Kb (16K x 8) | SPI | 40MHz | - | - | 2 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
STMicroelectronics |
IC EPROM UV 32MBIT 100NS 42CDIP
|
封装: 42-CDIP (0.600", 15.24mm) Window |
库存3,936 |
|
EPROM | EPROM - UV | 32Mb (2M x 16) | Parallel | - | - | 100ns | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Through Hole | 42-CDIP (0.600", 15.24mm) Window | 42-CDIP Frit Seal with Window |
||
Micron Technology Inc. |
IC SDRAM 512MBIT 167MHZ 66TSOP
|
封装: 66-TSSOP (0.400", 10.16mm Width) |
库存17,448 |
|
DRAM | SDRAM - DDR | 512Mb (32M x 16) | Parallel | 167MHz | 15ns | 700ps | 2.3 V ~ 2.7 V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP |
||
Microchip Technology |
IC EEPROM 1KBIT 400KHZ 8TSSOP
|
封装: 8-TSSOP (0.173", 4.40mm Width) |
库存7,344 |
|
EEPROM | EEPROM | 1Kb (128 x 8) | I2C | 400kHz | 5ms | 900ns | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC FLASH 512KBIT 250NS 32PLCC
|
封装: 32-LCC (J-Lead) |
库存3,968 |
|
FLASH | FLASH | 512Kb (64K x 8) | Parallel | - | 20ms | 250ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28DIP
|
封装: 28-DIP (0.600", 15.24mm) |
库存2,320 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TC) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC OTP 512KBIT 150NS 28SOIC
|
封装: 28-SOIC (0.342", 8.69mm Width) |
库存2,000 |
|
EPROM | EPROM - OTP | 512Kb (64K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TC) | Surface Mount | 28-SOIC (0.342", 8.69mm Width) | 28-SOIC |
||
Cypress Semiconductor Corp |
IC SRAM 72MBIT 450MHZ 165FBGA
|
封装: 165-LBGA |
库存6,016 |
|
SRAM | SRAM - Synchronous, QDR II+ | 72Mb (2M x 36) | Parallel | 450MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
||
Micron Technology Inc. |
IC FLASH 4MBIT 55NS 48TSOP
|
封装: 48-TFSOP (0.724", 18.40mm Width) |
库存6,256 |
|
FLASH | FLASH - NOR | 4Mb (512K x 8, 256K x 16) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC EEPROM 2KBIT 400KHZ 8TSSOP
|
封装: 8-TSSOP (0.173", 4.40mm Width) |
库存3,232 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Cypress Semiconductor Corp |
IC SRAM 4MBIT 10NS 44TSOP
|
封装: 44-TSOP (0.400", 10.16mm Width) |
库存3,488 |
|
SRAM | SRAM - Asynchronous | 4Mb (512K x 8) | Parallel | - | 10ns | 10ns | 2.2 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
||
Cypress Semiconductor Corp |
IC FLASH 128MBIT 133MHZ 24BGA
|
封装: 24-TBGA |
库存8,040 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O | 133MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-BGA (6x8) |
||
Micron Technology Inc. |
IC DRAM 32G 1866MHZ
|
封装: - |
库存2,496 |
|
DRAM | SDRAM - Mobile LPDDR4 | 32Gb (512M x 64) | - | 1866MHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 64K I2C 400KHZ WAFER
|
封装: Die |
库存6,128 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Micron Technology Inc. |
IC DRAM 16G 2133MHZ FBGA
|
封装: - |
库存5,456 |
|
DRAM | SDRAM - Mobile LPDDR4 | 16Gb (512M x 32) | - | 2133MHz | - | - | 1.1V | -40°C ~ 125°C (TC) | - | - | - |
||
ON Semiconductor |
IC EEPROM SPI SER 2KB 8TSSOP
|
封装: - |
库存5,840 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 200MHZ 54TSOP
|
封装: - |
Request a Quote |
|
DRAM | SDRAM | 256Mbit | LVTTL | 200 MHz | - | 5 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 54-TSOP (0.400", 10.16mm Width) | 54-TSOP II |
||
Winbond Electronics |
IC FLASH 32MBIT SPI/QUAD 8WSON
|
封装: - |
Request a Quote |
|
FLASH | FLASH - NOR | 32Mbit | SPI - Quad I/O | 133 MHz | 3ms | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
||
Silicon Motion, Inc. |
IC FLASH 320GBIT EMMC 153BGA
|
封装: - |
Request a Quote |
|
FLASH | FLASH - NAND (SLC) | 320Gbit | eMMC | - | - | - | - | -40°C ~ 85°C | Surface Mount | 153-TFBGA | 153-BGA (11.5x13) |
||
Insignis Technology Corporation |
DDR 512MB X8 TSOPII 66L 10X22(X1
|
封装: - |
Request a Quote |
|
DRAM | SDRAM - DDR | 512Mbit | SSTL_2 | 200 MHz | - | - | 2.3V ~ 2.7V | 0°C ~ 70°C (TA) | Surface Mount | 66-TSSOP (0.400", 10.16mm Width) | 66-TSOP II |
||
ATP Electronics, Inc. |
10GB E.MMC 153 BALLS BGA C-TEMP
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC EEPROM 16KBIT I2C 8SOIC
|
封装: - |
Request a Quote |
|
EEPROM | EEPROM | 16Kbit | I2C | 1 MHz | 5ms | 450 ns | 1.6V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
onsemi |
IC EEPROM 1KBIT MICROWIRE 8DIP
|
封装: - |
Request a Quote |
|
EEPROM | EEPROM | 1Kbit | Microwire | 2 MHz | - | - | 1.8V ~ 5.5V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Micron Technology Inc. |
LPDDR5 32G 1GX32 FBGA
|
封装: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR5 | 32Gbit | Parallel | - | - | - | 1.05V | - | Surface Mount | 200-WFBGA | 200-WFBGA (10x14.5) |
||
Infineon Technologies |
IC FLASH 512MBIT HYPERBUS 24FBGA
|
封装: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 512Mbit | HyperBus | 200 MHz | 1.7ms | 5.45 ns | 1.7V ~ 2V | -40°C ~ 125°C (TA) | Surface Mount | 24-VBGA | 24-FBGA (6x8) |
||
Micron Technology Inc. |
NAND FLASH PLASTIC M71M
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC FLSH 1MBIT PARALLEL 32PLCC
|
封装: - |
Request a Quote |
|
FLASH | FLASH - NOR | 1Mbit | Parallel | - | 20µs | 55 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Rochester Electronics, LLC |
1K X 4 SRAM
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ISSI, Integrated Silicon Solution Inc |
32Mb,High-Speed,Async,2Mbx16, 12
|
封装: - |
Request a Quote |
|
SRAM | SRAM - Asynchronous | 32Mbit | Parallel | - | 12ns | 12 ns | 1.65V ~ 2.2V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP I |