图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC INCA-IP PHONE 324-LBGA
|
封装: 324-LBGA |
库存5,456 |
|
- | - | - | - | - | - | Surface Mount | 324-LBGA | PG-LBGA-324-3 |
||
Infineon Technologies |
IC CODEC W/TRANSCEIVER MQFP-44
|
封装: 44-QFP |
库存3,296 |
|
IOM-2, Parallel, SCI | 1 | 3.3V, 5V | 27mA | - | - | Surface Mount | 44-QFP | P-MQFP-44 |
||
Microsemi Corporation |
IC DGTL SWITCH 4K X 2K 220BGA
|
封装: 220-BGA |
库存7,376 |
|
- | 1 | 3 V ~ 3.6 V | 480mA | - | -40°C ~ 85°C | Surface Mount | 220-BGA | 220-BGA (17x17) |
||
Microsemi Corporation |
IC SLAC 8CH GCI/PCM 4IO 144LBGA
|
封装: 144-LBGA |
库存87,948 |
|
2-Wire | - | 3.3V | - | - | - | Surface Mount | 144-LBGA | 144-BGA (13x13) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
封装: 217-BBGA |
库存9,768 |
|
LIU | 6 | 3.135 V ~ 3.465 V | 725mA | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
Maxim Integrated |
MICRODAA VOICE DATA/FAX 32-QFN
|
封装: 32-VFQFN Exposed Pad |
库存7,568 |
|
Serial | 1 | 3 V ~ 3.6 V | 30mA | - | 0°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
封装: 38-TFSOP (0.173", 4.40mm Width) |
库存6,448 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Silicon Labs |
IC SLIC/CODEC PROG 38TSSOP
|
封装: 38-TFSOP (0.173", 4.40mm Width) |
库存10,536 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 16SOIC
|
封装: 16-SOIC (0.295", 7.50mm Width) |
库存4,864 |
|
- | 1 | 4.5 V ~ 5.5 V | 1.3mA | 10mW | -40°C ~ 110°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC BUFFER RECEIVE T1 IND 28-PLCC
|
封装: 28-LCC (J-Lead) |
库存7,376 |
|
TDM | 1 | - | 5mA | - | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 12CH 420TBGA
|
封装: 420-LBGA Exposed Pad |
库存4,720 |
|
LIU | 12 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 420-LBGA Exposed Pad | 420-TBGA (35x35) |
||
Maxim Integrated |
IC LIU 16CH T1/E1/J1 256CSBGA
|
封装: 256-LBGA, CSBGA |
库存4,064 |
|
LIU | 16 | 3.135 V ~ 3.465 V | 500mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
NXP |
IC C2K 900MHZ 16CH VOIP 625BGA
|
封装: - |
库存5,376 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC HDLC PROTOCOL CTLR 28PLCC
|
封装: 28-LCC (J-Lead) |
库存9,120 |
|
- | 1 | 4.75 V ~ 5.25 V | 1µA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38QFN
|
封装: 38-VFQFN Exposed Pad |
库存4,416 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Microsemi Corporation |
IC TRACKING BATT 100V 2CH 64QFN
|
封装: 64-VFQFN Exposed Pad |
库存4,208 |
|
PCM | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Texas Instruments |
IC QUAD PHONE RELAY DRVR 14-DIP
|
封装: 14-DIP (0.300", 7.62mm) |
库存251,616 |
|
- | 4 | - | - | - | 0°C ~ 70°C | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
||
NXP |
CABLE FST DEMOD 4TS DAC
|
封装: - |
库存4,048 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
VS9804:20% OH 100G CI-BCH-4
|
封装: - |
库存7,904 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC RECEIVER DTMF 18SOIC
|
封装: 18-SOIC (0.295", 7.50mm Width) |
库存6,960 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microchip Technology |
IC DGTL SWITCH QDX QUAD 160MQFP
|
封装: 160-BQFP Exposed Pad |
库存6,304 |
|
- | 4 | 3V ~ 3.6V | 64mA | - | -40°C ~ 85°C | Surface Mount | 160-BQFP Exposed Pad | 160-MQFP (28x28) |
||
Microchip Technology |
IC SLIC 2CH UNIV 100V 48QFN
|
封装: 48-VFQFN Exposed Pad |
库存6,288 |
|
4-Wire | 2 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Broadcom Limited |
ENTERPRISE SWITCHING
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
HIGH PERFORMANCE VDSL2/ADSL2 ROU
|
封装: - |
Request a Quote |
|
ADSL | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
ISDN S/T HDLC INTERFACE
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
MaxLinear, Inc. |
VOICECODEC PEF33004HLV21 LQFP100
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
Freedm32A1024L, High Density HDL
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
MULTI LAYER SWITCH
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
VDSL 35B+RNC SOC W/IPSEC+VOIP
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
5V E1/T1/J1 LINE INTERFACE
|
封装: - |
Request a Quote |
|
E1, J1, T1 | 1 | 4.75V ~ 5.25V | 125mA | - | 0°C ~ 70°C | Surface Mount | 144-BBGA, CSPBGA | 144-CSBGA (17x17) |