图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC NETWORK TERMINATOR MQFP-64
|
封装: 64-QFP |
库存4,608 |
|
ISDN | 4 | 7V | 1mA | 840mW | -40°C ~ 85°C | Surface Mount | 64-QFP | P-64-MQFP |
||
Infineon Technologies |
IC NETWORK TERM QUAD MQFP64
|
封装: 64-QFP |
库存6,768 |
|
ISDN | 4 | 7V | 1mA | 840mW | 0°C ~ 70°C | Surface Mount | 64-QFP | P-64-MQFP |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CH 16SOIC
|
封装: 16-SOIC (0.295", 7.50mm Width) |
库存24,000 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CH 32QFN
|
封装: 32-VQFN Exposed Pad |
库存3,120 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
Maxim Integrated |
IC TXRX T1/E1/J1 SGL-CHIP CSBGA
|
封装: 100-LFBGA, CSPBGA |
库存3,856 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Maxim Integrated |
IC TXRX E1 1-CHIP 5V 44-PLCC
|
封装: 44-LCC (J-Lead) |
库存5,856 |
|
E1 | 1 | 4.75 V ~ 5.25 V | 65mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Exar Corporation |
IC LIU SH T1/E1/J1 OCTAL 225BGA
|
封装: - |
库存3,824 |
|
- | 8 | 3.14 V ~ 3.47 V | - | - | -40°C ~ 85°C | - | - | - |
||
NXP |
IC C2K 650MHZ 8CH VOIP 625BGA
|
封装: - |
库存5,376 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC TXRX SGL T1/E1 68PLCC
|
封装: 68-LCC (J-Lead) |
库存15,732 |
|
- | 1 | 4.75 V ~ 5.25 V | 200mA | - | -40°C ~ 85°C | Surface Mount | 68-LCC (J-Lead) | 68-PLCC |
||
IXYS Integrated Circuits Division |
IC MOD PHONE LINE WIRE 1.07" PCB
|
封装: 18-DIP Module (0.850", 21.59mm), 9 Leads |
库存10,128 |
|
- | 1 | 5V | 5mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 9 Leads | 18-DIP |
||
IXYS Integrated Circuits Division |
IC MOD PHONE LINE WIRE 1.07" PCB
|
封装: 18-DIP Module (0.850", 21.59mm), 9 Leads |
库存5,152 |
|
- | 1 | 5V | 5mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 9 Leads | 18-DIP |
||
Microsemi Corporation |
IC VOICE PROCESSOR VCP 128TQFP
|
封装: 128-TQFP |
库存5,872 |
|
2-Wire | - | - | - | - | - | Surface Mount | 128-TQFP | 128-TQFP |
||
Silicon Labs |
IC PROSLIC FXS FXO -136V 42QFN
|
封装: 42-WFQFN Exposed Pad |
库存6,048 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
ams |
IC LINE INTERFACE TELEPH 32TQFP
|
封装: 32-TQFP |
库存2,144 |
|
Serial | 1 | - | 6mA | - | -25°C ~ 70°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 20-SOIC
|
封装: 20-SOIC (0.295", 7.50mm Width) |
库存3,712 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
封装: 16-SOIC (0.295", 7.50mm Width) |
库存17,772 |
|
- | 2 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 150MA 8FLTPK
|
封装: 8-SMD, Gull Wing |
库存17,580 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Surface Mount | 8-SMD, Gull Wing | 8-Flatpack |
||
Microsemi Corporation |
IC ECHO CANCELLER DUAL 28PLCC
|
封装: 28-LCC (J-Lead) |
库存7,504 |
|
Serial | 2 | 4.5 V ~ 5.5 V | 50mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microsemi Solutions Sdn Bhd. |
QUAD 10/100/1000BASE-T & 100BASE
|
封装: - |
库存5,424 |
|
- | 1 | - | - | - | - | Surface Mount | - | 256-BGA (17x17) |
||
Microsemi Corporation |
UNIV SLIC 145V QFN
|
封装: - |
库存7,472 |
|
Serial | 1 | 3.3V | - | - | - | Surface Mount | - | 28-QFN (4x5) |
||
Microchip Technology |
QFN48, GREEN, IND, MRLB, NO FLAS
|
封装: 48-VFQFN Exposed Pad |
库存29,424 |
|
SPI | 1 | 3 V ~ 3.6 V | - | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) |
||
Microchip Technology |
IC RECEIVER DTMF 18DIP
|
封装: 18-DIP (0.300", 7.62mm) |
库存6,464 |
|
- | 1 | 2.7V ~ 3.6V | 2mA | - | -40°C ~ 85°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
Broadcom Limited |
8GE + 2XHG SWITCH
|
封装: - |
库存6,752 |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
ISAC-S ISDN ACCESS CONTROLLER
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
GIGABIT ETH SWITCH 24GE 4XHG
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
MaxLinear, Inc. |
TRANSVR IC GPY215C0VI VQFN56 SLN
|
封装: - |
Request a Quote |
|
SGMII | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-VQFN (7x7) |
||
Infineon Technologies |
TELEPHONY INTERFACE CIRCUIT
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Lantiq |
VINETIC SMART SLIC-T16
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
DUSLIC DUAL CHANNEL SLIC
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
ITU CO/LOOP CARRIER SLIC
|
封装: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 4.75V ~ 5.25V | - | 200 mW | -40°C ~ 85°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |