图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices Inc. |
IC CCD SGNL PROC 14BIT 84CSBGA
|
封装: 84-LFBGA, CSPBGA |
库存6,704 |
|
- | - | 3-Wire Serial | - | -25°C ~ 85°C | Surface Mount | 84-LFBGA, CSPBGA | 84-CSPBGA (6x6) |
|
|
NXP |
IC SMOKE DETECT WITH I/O 16SOIC
|
封装: 16-SOIC (0.295", 7.50mm Width) |
库存38,796 |
|
Photoelectric | Voltage | - | 12µA | -10°C ~ 60°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
|
|
Maxim Integrated |
IC COMPARATOR DL TMP 3/5V FCHIP
|
封装: 8-FlipChip |
库存6,160 |
|
Analog | Digital | - | 225µA | -40°C ~ 125°C | Surface Mount | 8-FlipChip | 8-FlipChip |
|
|
Maxim Integrated |
IC SIGNAL COND QUAD 68-QFN
|
封装: 68-VFQFN Exposed Pad |
库存5,088 |
|
CML | CML | LVTTL | 495mA | 0°C ~ 85°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN Exposed Pad (10x10) |
|
|
Exar Corporation |
SENSOR
|
封装: 24-WFQFN Exposed Pad |
库存7,744 |
|
- | - | I2C | 457µA | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-QFN (3.5x3.5) |
|
|
|
Exar Corporation |
SENSOR
|
封装: 24-WFQFN Exposed Pad |
库存6,592 |
|
- | - | I2C | 457µA | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-QFN (3.5x3.5) |
|
|
Intersil |
IC TOF SIGNAL PROCESSOR 24QFN
|
封装: 24-VFQFN Exposed Pad |
库存6,384 |
|
- | - | I2C | - | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x5) |
|
|
Melexis Technologies NV |
IC OPTICAL PROXIMITY 24QFN
|
封装: - |
库存7,856 |
|
- | - | - | 2.1mA | -40°C ~ 125°C | - | - | - |
|
|
Linear Technology |
IC THERMOCOUPLE AMPLIFIER 8-DIP
|
封装: 8-DIP (0.300", 7.62mm) |
库存4,000 |
|
Voltage | Thermocouple | - | 800µA | 0°C ~ 70°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
|
|
|
Diodes Incorporated |
PIR CONTROLLER PDIP-16
|
封装: - |
库存5,072 |
|
- | - | - | 120µA | -20°C ~ 70°C | - | - | - |
|
|
|
Microchip Technology |
IC DRIVER HORN PIEZO W/BO 8DIP
|
封装: 8-DIP (0.300", 7.62mm) |
库存5,984 |
|
Voltage | Voltage | CMOS | 300µA | -10°C ~ 60°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
|
|
Microchip Technology |
IC SMOKE DETECT PHOTO MEM 16SOIC
|
封装: 16-SOIC (0.154", 3.90mm Width) |
库存7,664 |
|
Photoelectric | Voltage | - | 6µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
|
|
Microchip Technology |
IC HORN DRIVER DUAL 14SOIC
|
封装: 14-SOIC (0.154", 3.90mm Width) |
库存18,360 |
|
Logic | Logic | Logic | 500µA | 0°C ~ 50°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
|
|
Texas Instruments |
IC 4-20MA 2-WIRE TRNSMTR 24-QSOP
|
封装: 24-SSOP (0.154", 3.90mm Width) |
库存78,528 |
|
Voltage | Voltage | 2-Wire | 20mA | -55°C ~ 125°C | Surface Mount | 24-SSOP (0.154", 3.90mm Width) | 24-SSOP/QSOP |
|
|
Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR 32-LFCSP
|
封装: 32-WFQFN Exposed Pad, CSP |
库存36,000 |
|
Logic | Logic | 3-Wire Serial | - | -20°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad, CSP | 32-LFCSP-WQ (5x5) |
|
|
|
Infineon Technologies |
IC SWITCH PROXIMITY INDCT 16DSO
|
封装: 16-SOIC (0.154", 3.90mm Width) |
库存23,442 |
|
Analog | Analog | - | 550µA | -40°C ~ 110°C | - | 16-SOIC (0.154", 3.90mm Width) | PG-DSO-16-1 |
|
|
ams |
IC CONVERTER TIME-FLIGHT 64QFN
|
封装: 64-VFQFN Exposed Pad |
库存7,704 |
|
LVDS | LVDS | SPI | 2mA | -40°C ~ 125°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
|
|
Maxim Integrated |
IC SENSOR SIGNAL COND 16-SSOP
|
封装: 16-SSOP (0.209", 5.30mm Width) |
库存12,696 |
|
Analog | Analog | Serial | 2.5mA | -40°C ~ 125°C | Surface Mount | 16-SSOP (0.209", 5.30mm Width) | 16-SSOP |
|
|
Linear Technology |
IC THERMOCOUPL COMP& KIT 8DIP
|
封装: 8-CDIP (0.300", 7.62mm) |
库存7,600 |
|
Voltage | Thermocouple | - | 800µA | 0°C ~ 70°C | Through Hole | 8-CDIP (0.300", 7.62mm) | 8-CERDIP |
|
|
|
Renesas Electronics Corporation |
DICE ON 304 MICRO METER WAFER NO
|
封装: - |
Request a Quote |
|
Analog, Digital | 1-Wire®, I2C, SPI | - | 15 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Die |
|
|
|
Renesas Electronics Corporation |
WAFER (UNSAWN) - WAFER BOX
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
STMicroelectronics |
FLEXINPUT IC FOR AUTOMOTIVE APPL
|
封装: - |
库存6,990 |
|
Analog, Digital | SPI | - | - | - | Surface Mount | 48-TQFP Exposed Pad | 48-TQFP-EP (7x7) |
|
|
|
Texas Instruments |
DIGITAL SENSOR OUTPUT DRIVER WIT
|
封装: - |
库存11,325 |
|
Logic | - | - | 2.95 mA | -40°C ~ 125°C (TA) | Surface Mount | 10-VFDFN Exposed Pad | 10-VSON (3x3) |
|
|
|
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Analog Devices Inc. |
OPTICAL AFE FOR WEARABLES-SPI
|
封装: - |
库存12,459 |
|
Digital | SPI | - | 10 µA | -40°C ~ 85°C | Surface Mount | 35-UFBGA, WLCSP | 35-WLCSP (3.11x2.14) |
|
|
|
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
TSSOP / 14 / 4,4MM G1 - TUBE
|
封装: - |
Request a Quote |
|
Capacitive | I2C, SPI | - | 1.1 mA | -40°C ~ 85°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
|
|
|
Renesas Electronics Corporation |
TSSOP / 14 / 4,4MM G1 - TAPE&REE
|
封装: - |
Request a Quote |
|
Capacitive | I2C, SPI | - | 1.1 mA | -40°C ~ 85°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
