嵌入式 - 片上系统 (SoC)

M2S090S-1FG484I

Microsemi Corporation

IC FPGA SOC 90K LUTS 484FBGA

• Architecture: MCU, FPGA
• Core Processor: ARM? Cortex?-M3
• Flash Size: 512KB
• RAM Size: 64KB
• Peripherals: DDR, PCIe, SERDES
• Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
• Speed: 166MHz
• Primary Attributes: FPGA - 90K Logic Modules
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FPBGA (23x23)

封装: 484-BGA

10AS066N3F40E2LG

Altera

IC SOC FPGA 588 I/O 1517FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 660K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

封装: 1517-BBGA, FCBGA

XCZU5EG-3FBVB900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

封装: 900-BBGA, FCBGA

M2S150TS-1FCV484I

Microsemi Corporation

IC FPGA SOC 150K LUTS

• Architecture: MCU, FPGA
• Core Processor: ARM? Cortex?-M3
• Flash Size: 512KB
• RAM Size: 64KB
• Peripherals: DDR, PCIe, SERDES
• Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
• Speed: 166MHz
• Primary Attributes: FPGA - 150K Logic Modules
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BFBGA
• Supplier Device Package: 484-BGA

封装: 484-BFBGA

XCZU2CG-2SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

封装: 784-BBGA, FCBGA

M2S025TS-1FGG484I

Microsemi Corporation

IC FPGA SOC 25K LUTS 484FBGA

• Architecture: MCU, FPGA
• Core Processor: ARM? Cortex?-M3
• Flash Size: 256KB
• RAM Size: 64KB
• Peripherals: DDR, PCIe, SERDES
• Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
• Speed: 166MHz
• Primary Attributes: FPGA - 25K Logic Modules
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FPBGA (23x23)

封装: 484-BGA

M2S010TS-FGG484I

Microsemi Corporation

IC FPGA SOC 10K LUTS

• Architecture: MCU, FPGA
• Core Processor: ARM? Cortex?-M3
• Flash Size: 256KB
• RAM Size: 64KB
• Peripherals: DDR, PCIe, SERDES
• Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
• Speed: 166MHz
• Primary Attributes: FPGA - 10K Logic Modules
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FPBGA (23x23)

封装: 484-BGA

M2S025T-VFG400

Microsemi Corporation

IC FPGA SOC 25K LUTS 400VFBGA

• Architecture: MCU, FPGA
• Core Processor: ARM? Cortex?-M3
• Flash Size: 256KB
• RAM Size: 64KB
• Peripherals: DDR, PCIe, SERDES
• Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
• Speed: 166MHz
• Primary Attributes: FPGA - 25K Logic Modules
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-VFBGA (17x17)

封装: 400-LFBGA

1SX280LH3F55E2LG

Intel

2912-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2800K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

5ASXBB3D4F35I5N

Intel

IC FPGA 350 I/O 1152FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: FPGA - 350K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

10AS027H2F34E2LG

Intel

1152-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 270K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

R8A77610DA01BGV#YE

Renesas Electronics America

IC SOC SH-4A 400MHZ 449BGA

• Architecture: MPU
• Core Processor: SH-4A
• Flash Size: -
• RAM Size: 16KB
• Peripherals: DDR
• Connectivity: CANbus, I²C, SCI, SD, SSI, USB
• Speed: 400MHz
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: 449-BGA
• Supplier Device Package: 449-BGA (21x21)

封装: 449-BGA

XCVC1702-2HSIVSVA1596

AMD

XCVC1702-2HSIVSVA1596

• Architecture: MPU, FPGA
• Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DDR, DMA, PCIe
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz, 1.65GHz
• Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
• Operating Temperature: -40°C ~ 110°C (TJ)
• Package / Case: 1596-BFBGA, FCBGA
• Supplier Device Package: 1596-FCBGA (37.5x37.5)

封装: -

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XCVC1902-1MSEVSVD1760

AMD

IC VERSAL AICORE FPGA 1760BGA

• Architecture: MPU, FPGA
• Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DDR, DMA, PCIe
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.3GHz
• Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BFBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (40x40)

封装: -

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XCVP1402-1LSEVSVA3340

AMD

IC VERSAL PREM ACAP FPGA 3340BGA

• Architecture: MPU, FPGA
• Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DDR, DMA, PCIe
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 400MHz, 1GHz
• Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 3340-BFBGA, FCBGA
• Supplier Device Package: 3340-FCBGA (55x55)

封装: -

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AGFB023R25A2I2V

Intel

IC FPGA AGILEX-F 2581FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

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BCM3380MIFSBG

Broadcom Limited

DOCSIS 3.0 STB FRONT END I-TEMP

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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1SX210HU1F50I2VG

Intel

IC FPGA STRATIX 10 2397FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2100K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

封装: -

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AGFA008R24C2I1VB

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 764K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

封装: -

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XCZU2EG-2UBVA530I

AMD

IC SOC CORTEX-A53 530BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 530-WFBGA, FCBGA
• Supplier Device Package: 530-FCBGA (16x9.5)

封装: -

SC2200UCL-300

National Semiconductor

MICRO PERIPHERAL IC PBGA432

• Architecture: MPU
• Core Processor: x86
• Flash Size: -
• RAM Size: -
• Peripherals: AC97/AMC97, DMA, PCI, SmartCard, WDT
• Connectivity: Access.bus, GPIO, PC/AT, UART
• Speed: 300MHz
• Primary Attributes: -
• Operating Temperature: 0°C ~ 85°C (TC)
• Package / Case: 432-BGA Exposed Pad
• Supplier Device Package: 432-EBGA (40x40)

封装: -

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AGIB027R31A1E1V

Intel

IC

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.7M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 3184-BFBGA Exposed Pad
• Supplier Device Package: 3184-BGA (56x45)

封装: -

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AGFA019R31C2E1V

Intel

IC FPGA AGILEX-F 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 3184-BFBGA Exposed Pad
• Supplier Device Package: 3184-BGA (56x45)

封装: -

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AGFB006R24D2E3V

Intel

IC

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 573K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

封装: -

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AGFB019R25A3E4X

Intel

IC FPGA AGILEX-F 2581FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

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XCVM1302-2MLINBVB1024

AMD

IC VERSALPRIME ACAP FPGA 1024BGA

• Architecture: MPU, FPGA
• Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
• Flash Size: -
• RAM Size: -
• Peripherals: DDR, DMA, PCIe
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.4GHz
• Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1024-BFBGA
• Supplier Device Package: 1024-BGA (31x31)

封装: -

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AGFB014R24B2E4F

Intel

IC FPGA AGILEX-F 2486FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.4M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

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TDA3MVRB1ABFQ1

Texas Instruments

PROTOTYPE

• Architecture: DSP, MPU
• Core Processor: ARM® Cortex®-M4, C66x
• Flash Size: -
• RAM Size: 512kB
• Peripherals: DMA, PWM, WDT
• Connectivity: CANbus, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
• Speed: 212.8MHz, 745MHz
• Primary Attributes: -
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 367-BFBGA, FCBGA
• Supplier Device Package: 367-FCBGA (15x15)

封装: -

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XCZU1EG-1SFVC784I

AMD

IC ZUP MPSOC A53 FPGA 784BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: -
• Speed: 500MHz, 600MHz, 1.2GHz
• Primary Attributes: -
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 784-BFBGA, FCBGA
• Supplier Device Package: 784-FCBGA (23x23)

封装: -

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AGID019R18A2E1V

Intel

IC FPGA AGILEX-I 1805FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

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