图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU MPC85XX 1.067GHZ 783BGA
|
封装: 783-BBGA, FCBGA |
库存7,936 |
|
1 Core, 32-Bit | 1.067GHz | Communications; QUICC Engine | DDR2, DDR3, SDRAM | No | - | 10/100 Mbps (8), 1 Gbps (4) | - | USB 2.0 (1) | 1.0V, 1.5V, 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 1.25GHZ 783FCBGA
|
封装: 783-BBGA, FCBGA |
库存7,520 |
|
1 Core, 32-Bit | 1.25GHz | Security; SEC | DDR2, DDR3 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 (3) | 1.8V, 2.5V, 3.3V | 0°C ~ 90°C (TA) | Cryptography | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
Texas Instruments |
IC MPU OMAP-35XX 600MHZ 423FCBGA
|
封装: 423-LFBGA, FCBGA |
库存25,944 |
|
1 Core, 32-Bit | 600MHz | Multimedia; NEON? SIMD | LPDDR | Yes | LCD | - | - | USB 1.x (3), USB 2.0 (1) | 1.8V, 3.0V | 0°C ~ 90°C (TJ) | - | 423-LFBGA, FCBGA | 423-FCBGA (16x16) |
||
NXP |
IC MPU MPC86XX 1.5GHZ 994FCCBGA
|
封装: 994-BCBGA, FCCBGA |
库存4,800 |
|
1 Core, 32-Bit | 1.5GHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 994-BCBGA, FCCBGA | 994-FCCBGA (33x33) |
||
IDT, Integrated Device Technology Inc |
IC MPU MIPS-I 20MHZ 100TQFP
|
封装: 100-LQFP |
库存6,544 |
|
1 Core, 32-Bit | 20MHz | System Control; CP0 | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 85°C (TC) | - | 100-LQFP | 100-TQFP (14x14) |
||
NXP |
IC MPU MPC8XX 66MHZ 256BGA
|
封装: 256-BBGA |
库存3,520 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | -40°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC74XX 1.6GHZ 360FCCBGA
|
封装: 360-BCBGA, FCCBGA |
库存2,720 |
|
1 Core, 32-Bit | 1.6GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - | 360-BCBGA, FCCBGA | 360-FCCBGA (25x25) |
||
Zilog |
IC MPU Z80 20MHZ 44PLCC
|
封装: 44-LCC (J-Lead) |
库存3,008 |
|
1 Core, 8-Bit | 20MHz | - | - | No | - | - | - | - | 5.0V | -40°C ~ 100°C (TA) | - | 44-LCC (J-Lead) | 44-PLCC |
||
Advantech Corp |
XEON 2.2G 25M 2011P 10CORE 75W
|
封装: - |
库存3,936 |
|
10 Core, 64-Bit | 2.2GHz | - | - | - | - | - | - | - | - | - | - | - | - |
||
Advantech Corp |
CORE 2.6G 4M 1150P 2CORE I3-4340
|
封装: - |
库存3,392 |
|
2 Core, 64-Bit | 2.6GHz | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU MPC8XX 50MHZ 357BGA
|
封装: 357-BBGA |
库存16,548 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (4) | - | - | 3.3V | -40°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
封装: 689-BBGA Exposed Pad |
库存4,672 |
|
1 Core, 32-Bit | 800MHz | Communications; QUICC Engine | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
Intel |
IC MPU I960 33MHZ 132QFP
|
封装: 132-QFP |
库存7,248 |
|
1 Core, 32-Bit | 33MHz | - | - | No | - | - | - | - | 3.3V | 0°C ~ 100°C (TC) | - | 132-QFP | 132-QFP |
||
Intel |
IC MPU I960 25MHZ 132QFP
|
封装: 132-BQFP Bumpered |
库存103,680 |
|
1 Core, 32-Bit | 25MHz | - | - | No | - | - | - | - | 3.3V | 0°C ~ 100°C (TC) | - | 132-BQFP Bumpered | 132-QFP |
||
NXP |
IC MPU MPC8XX 100MHZ 357BGA
|
封装: 357-BBGA |
库存3,984 |
|
1 Core, 32-Bit | 100MHz | Communications; CPM | DRAM | No | - | 10 Mbps (4), 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 100°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU I.MX53 1.0GHZ 529TEBGA-2
|
封装: 529-FBGA |
库存7,596 |
|
1 Core, 32-Bit | 1.0GHz | Multimedia; NEON? SIMD | LPDDR2, DDR2, DDR3 | Yes | Keypad, LCD | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (2) | 1.3V, 1.8V, 2.775V, 3.3V | -20°C ~ 85°C (TC) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 529-FBGA | 529-TEPBGA-2 (19x19) |
||
NXP |
QORIQ64B POWER ARCH8X 1.2GHZ T
|
封装: - |
库存4,976 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
QORIQ 4X E5500 1500MHZ DDR3L/
|
封装: - |
库存6,688 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
QORIQ 1XCPU 64-BIT PWR ARCH 1.
|
封装: - |
库存5,568 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX 6 SERIES 32-BIT MPU DUAL A
|
封装: 624-FBGA, FCBGA |
库存2,976 |
|
2 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
Broadcom Limited |
DUAL CORE
|
封装: - |
库存4,848 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
STMicroelectronics |
MPU ARM DUAL CORTEX-A7 650 MHZ A
|
封装: 448-LFBGA |
库存7,920 |
|
2 Core, 32-Bit | 209MHz, 650MHz | ARM® Cortex®-M4 | LPDDR2, LPDDR3, DDR3, DDR3L | Yes | HDMI, LCD | 10/100Mbps, GbE | - | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | 2.5V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ | 448-LFBGA | 448-LFBGA (18x18) |
||
STMicroelectronics |
MPU ARM DUAL CORTEX-A7 650 MHZ A
|
封装: 448-LFBGA |
库存6,912 |
|
2 Core, 32-Bit | 209MHz, 650MHz | ARM® Cortex®-M4 | LPDDR2, LPDDR3, DDR3, DDR3L | Yes | HDMI, LCD | 10/100Mbps, GbE | - | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | 2.5V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ | 448-LFBGA | 448-LFBGA (18x18) |
||
NXP |
LAYERSCAPE 64-BIT ARM CORTEX-A72
|
封装: - |
Request a Quote |
|
1 Core, 64-Bit | 1.5GHz | - | DDR3L, DDR4 | Yes | - | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | USB 3.0 (2) | - | -40°C ~ 105°C (TA) | Secure Boot, TrustZone® | 448-BFBGA | 448-FBGA (17x17) |
||
NXP |
I.MX8ULP, SOLO 800MHZ
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Freescale Semiconductor |
IC MPU I.MXL 150MHZ 256BGA
|
封装: - |
Request a Quote |
|
1 Core, 32-Bit | 150MHz | - | SDRAM | No | LCD | - | - | USB (1) | 1.8V, 3V | -30°C ~ 70°C (TA) | - | 256-LFBGA | 256-PBGA (14x14) |
||
Renesas Electronics Corporation |
8-BIT MICROPROCESSOR
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Intersil |
ENGINE KNOCK SIGNAL PROCESSOR
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX8DUALXLITE 15SQ
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU I.MX8MN 1.4GHZ 306TFBGA
|
封装: - |
库存288 |
|
4 Core, 64-Bit | 1.4GHz | Multimedia; NEON™ MPE | DDR3L, DDR4, LPDDR4 | Yes | LCD, MIPI-CSI, MIPI-DSI | GbE | - | USB 2.0 OTG + PHY (1) | - | 0°C ~ 95°C (TJ) | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | 306-TFBGA | 306-TFBGA (11x11) |