图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU MPC85XX 800MHZ 783FCBGA
|
封装: 783-BBGA, FCBGA |
库存7,392 |
|
1 Core, 32-Bit | 800MHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
Texas Instruments |
IC MPU OMAP-L1X 456MHZ 256BGA
|
封装: 256-BGA |
库存7,504 |
|
1 Core, 32-Bit | 456MHz | Signal Processing; C674x, System Control; CP15 | SDRAM | No | LCD | 10/100 Mbps (1) | - | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1.8V, 3.3V | -40°C ~ 90°C (TJ) | - | 256-BGA | 256-BGA (17x17) |
||
Texas Instruments |
IC MPU OMAP-35XX 600MHZ 423FCBGA
|
封装: 423-LFBGA, FCBGA |
库存7,936 |
|
1 Core, 32-Bit | 600MHz | Signal Processing; C64x+, Multimedia; NEON? SIMD | LPDDR | Yes | LCD | - | - | USB 1.x (3), USB 2.0 (1) | 1.8V, 3.0V | -40°C ~ 105°C (TJ) | - | 423-LFBGA, FCBGA | 423-FCBGA (16x16) |
||
NXP |
IC MPU M683XX 66MHZ 196BGA
|
封装: 196-PBGA |
库存3,888 |
|
1 Core, 32-Bit | 66MHz | - | DRAM | No | LCD, Touch Panel | - | - | - | 3.0V | -40°C ~ 85°C (TA) | - | 196-PBGA | 196-BGA |
||
NXP |
IC MPU MPC83XX 266MHZ 516BGA
|
封装: 516-BBGA |
库存5,152 |
|
1 Core, 32-Bit | 266MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100 Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC8XX 66MHZ 357BGA
|
封装: 357-BBGA |
库存6,832 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (4), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC74XX 1.4GHZ 360FCCBGA
|
封装: 360-BCBGA, FCCBGA |
库存7,296 |
|
1 Core, 32-Bit | 1.4GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - | 360-BCBGA, FCCBGA | 360-FCCBGA (25x25) |
||
NXP |
IC MPU MPC74XX 1.25GHZ 360FCCBGA
|
封装: 360-BCBGA, FCCBGA |
库存7,776 |
|
1 Core, 32-Bit | 1.25GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - | 360-BCBGA, FCCBGA | 360-FCCBGA (25x25) |
||
NXP |
IC MPU M683XX 33MHZ 241PGA
|
封装: 241-BEPGA |
库存5,552 |
|
1 Core, 32-Bit | 33MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 241-BEPGA | 241-PGA (47.24x47.24) |
||
NXP |
IC MPU MPC82XX 200MHZ 408TBGA
|
封装: 480-LBGA |
库存6,496 |
|
1 Core, 32-Bit | 200MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
封装: 620-BBGA Exposed Pad |
库存4,256 |
|
1 Core, 32-Bit | 400MHz | Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
Intel |
IC MPU XSCALE 400MHZ 492BGA
|
封装: 492-BBGA |
库存6,352 |
|
1 Core, 32-Bit | 400MHz | Communications; Network Processor Engine, Math Engine; Multiply-Accumulate | SDRAM | No | - | 10/100 Mbps (2) | - | USB 1.1 (1) | 3.3V | 0°C ~ 70°C (TA) | Cryptography | 492-BBGA | 492-BGA (35x35) |
||
Advantech Corp |
XEON 2.0G 20M 2011P 8CORE E5-264
|
封装: - |
库存2,096 |
|
8 Core, 64-Bit | 2.0GHz | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU MPC74XX 1.7GHZ 360FCCBGA
|
封装: 360-CBGA, FCCBGA |
库存7,792 |
|
1 Core, 32-Bit | 1.7GHz | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | 0°C ~ 105°C (TA) | - | 360-CBGA, FCCBGA | 360-FCCBGA (25x25) |
||
Advantech Corp |
CORE 2.2G 3M 988P 2CORE I3-2330E
|
封装: - |
库存6,320 |
|
2 Core, 64-Bit | 2.2GHz | - | - | Yes | - | - | - | - | - | - | - | - | - |
||
NXP |
IC MPU MPC83XX 400MHZ 668BGA
|
封装: 668-BBGA Exposed Pad |
库存3,744 |
|
1 Core, 32-Bit | 400MHz | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 668-BBGA Exposed Pad | 668-PBGA-PGE (29x29) |
||
NXP |
IC MPU I.MX6DL 800MHZ 624MAPBGA
|
封装: 624-LFBGA |
库存6,208 |
|
2 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-LFBGA | 624-MAPBGA (21x21) |
||
NXP |
IC MPU MPC83XX 267MHZ 516BGA
|
封装: 516-BBGA Exposed Pad |
库存6,416 |
|
1 Core, 32-Bit | 267MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) |
||
NXP |
IC MPU MPC82XX 266MHZ 408TBGA
|
封装: 480-LBGA |
库存3,920 |
|
1 Core, 32-Bit | 266MHz | Communications; RISC CPM | DRAM, SDRAM | No | - | 10/100 Mbps (3) | - | - | 3.3V | -40°C ~ 105°C (TA) | - | 480-LBGA | 408-TBGA (37.5x37.5) |
||
NXP |
IC MPU MPC83XX 400MHZ 672TBGA
|
封装: 672-LBGA |
库存6,352 |
|
1 Core, 32-Bit | 400MHz | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 672-LBGA | 672-TBGA (35x35) |
||
NXP |
LS1 32BIT ARM SOC 1.2GHZ DDR3/
|
封装: 525-FBGA, FCBGA |
库存6,528 |
|
2 Core, 32-Bit | 1.2GHz | Multimedia; NEON™ SIMD | DDR3L, DDR4 | No | - | GbE (3) | SATA 3Gbps (1) | USB 2.0 (1), USB 3.0 + PHY | - | 0°C ~ 105°C | - | 525-FBGA, FCBGA | 525-FCPBGA (19x19) |
||
Advantech Corp |
CORE 2.9G 8M 1151P 4CORE I7-7700
|
封装: - |
库存2,080 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
STMicroelectronics |
IC MPU STM32MP1 800MHZ 257TFBGA
|
封装: - |
Request a Quote |
|
2 Core, 32-Bit | 209MHz, 800MHz | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2, LPDDR3 | Yes | HDMI-CEC, LCD | 10/100Mbps (1) | - | USB 2.0 (2), USB 2.0 OTG+ PHY (3) | 2.5V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ | 257-TFBGA | 257-TFBGA (10x10) |
||
NXP |
8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2
|
封装: - |
Request a Quote |
|
4 Core, 64-Bit/8 Core, 32-Bit | 400MHz, 1GHz | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | 2.5Gbps (3) | - | USB 2.0 OTG (1) | 1.8V, 3.3V | -40°C ~ 105°C (TA) | ARM TZ, Boot Security, TRNG | 525-FBGA, FCBGA | 525-FCPBGA (19x19) |
||
NXP |
S32G254A ARM CORTEX-M7 AND -A53,
|
封装: - |
Request a Quote |
|
3 Core, 64-Bit/2 Core, 32-Bit | 400MHz, 1GHz | Multimedia; NEON | DDR3L, LPDDR4 | No | - | GbE (4) | - | USB 2.0 OTG (1) | 1.2V, 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | 525-FBGA, FCBGA | 525-FCPBGA (19x19) |
||
NXP |
I.MX 8QUADXPLUS 21X21
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Lumissil Microsystems |
INTEGRATED APPLICATION PROCESSOR
|
封装: - |
Request a Quote |
|
1 Core, 32-Bit | 1GHz | - | DDR2 | No | DVP, LCD, MIPI-CSI, RGB | 10/100Mbps (1) | - | USB 2.0 OTG (1) | 1.8V, 3.3V | -40°C ~ 85°C (TA) | - | 159-LFBGA | 159-BGA (9x9) |
||
NXP |
IC MPU I.MX7ULP 720MHZ 361VFBGA
|
封装: - |
Request a Quote |
|
2 Core, 32-Bit | 720MHz | ARM® Cortex®-M4 | LPDDR2, LPDDR3 | Yes | MIPI-DSI | - | - | USB 2.0 (2) | - | 0°C ~ 95°C (TJ) | Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot | 361-VFBGA | 361-VFBGA (10x10) |
||
NXP |
POWERQUICC 32 BIT POWER ARCHITEC
|
封装: - |
Request a Quote |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10Mbps (4) | - | - | 3.3V | 0°C ~ 95°C (TJ) | - | 357-BBGA | 357-PBGA (25x25) |
||
Renesas Electronics Corporation |
8-BIT MICROPROCESSOR
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |