图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU Q OR IQ 1.3GHZ 780FCBGA
|
封装: - |
库存10,584 |
|
4 Core, 32-Bit | 1.3GHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (5), 10 Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | - | 780-FCPBGA (23x23) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
封装: 783-BBGA, FCBGA |
库存7,056 |
|
1 Core, 32-Bit | 1.0GHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
封装: 561-FBGA |
库存2,256 |
|
1 Core, 32-Bit | 667MHz | Security; SEC 3.3 | DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | Cryptography, Random Number Generator | 561-FBGA | 561-TEPBGA1 (23x23) |
||
NXP |
IC MPU MPC83XX 266MHZ 473MAPBGA
|
封装: 473-LFBGA |
库存7,232 |
|
1 Core, 32-Bit | 266MHz | - | DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 473-LFBGA | 473-MAPBGA (19x19) |
||
NXP |
IC MPU Q OR IQ 1.067GHZ 689TBGA
|
封装: 689-BBGA Exposed Pad |
库存5,248 |
|
2 Core, 32-Bit | 1.067GHz | Security; SEC | DDR2, DDR3 | No | LCD | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
封装: 783-BBGA, FCBGA |
库存4,416 |
|
1 Core, 32-Bit | 1.0GHz | Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC85XX 1.333GHZ 783BGA
|
封装: 783-BBGA, FCBGA |
库存7,568 |
|
1 Core, 32-Bit | 1.333GHz | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000 Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC MPU MPC83XX 266MHZ 620BGA
|
封装: 620-BBGA Exposed Pad |
库存5,376 |
|
1 Core, 32-Bit | 266MHz | Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU M683XX 25MHZ 357BGA
|
封装: 357-BGA |
库存3,888 |
|
1 Core, 32-Bit | 25MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 5.0V | -40°C ~ 85°C (TA) | - | 357-BGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 50MHZ 357BGA
|
封装: 357-BBGA |
库存3,856 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (4), 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 80MHZ 357BGA
|
封装: 357-BBGA |
库存4,800 |
|
1 Core, 32-Bit | 80MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU Q OR IQ 800MHZ 780FCBGA
|
封装: - |
库存6,288 |
|
4 Core, 32-Bit | 800MHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (5) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | - | 780-FCPBGA (23x23) |
||
NXP |
IC MPU MPC83XX 667MHZ 620BGA
|
封装: 620-BBGA Exposed Pad |
库存6,096 |
|
1 Core, 32-Bit | 667MHz | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC8XX 80MHZ 357BGA
|
封装: 357-BBGA |
库存18,552 |
|
1 Core, 32-Bit | 80MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | 0°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU I.MX35 532MHZ 400MAPBGA
|
封装: 400-LFBGA |
库存3,328 |
|
1 Core, 32-Bit | 532MHz | Multimedia; GPU, IPU, VFP | LPDDR, DDR2 | Yes | Keypad, KPP, LCD | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | -40°C ~ 85°C (TA) | Secure Fusebox, Secure JTAG, Tamper Detection | 400-LFBGA | 400-MAPBGA (17x17) |
||
NXP |
IC MPU I.MX6UL 289BGA
|
封装: - |
库存5,552 |
|
1 Core, 32-Bit | 528MHz | Multimedia; NEON? SIMD | LPDDR2, DDR3, DDR3L | No | LVDS | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | - | - |
||
Zilog |
IC MPU Z180 10MHZ 80QFP
|
封装: 80-BQFP |
库存14,844 |
|
1 Core, 8-Bit | 10MHz | - | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 80-BQFP | 80-QFP |
||
NXP |
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
封装: 624-LFBGA |
库存4,352 |
|
1 Core, 32-Bit | 1.0GHz | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -20°C ~ 105°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-LFBGA | 624-MAPBGA (21x21) |
||
NXP |
QORIQ 64B POWER ARCH 8X 1.5GHZ
|
封装: - |
库存4,752 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
QORIQ 64B POWER ARCH 8X 1.2GHZ
|
封装: - |
库存2,224 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
I.MX 6SL ROM PERF ENHAN
|
封装: 432-TFBGA |
库存2,032 |
|
1 Core, 32-Bit | 1.0GHz | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | -40°C ~ 105°C (TA) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 432-TFBGA | 432-MAPBGA (13x13) |
||
Intel |
IC MPU INTEL 600MHZ 1356FCBGA
|
封装: - |
Request a Quote |
|
1 Core, 32-Bit | 600MHz | - | DDR SDRAM, SRAM | No | LVDS | - | - | - | 3.3V | -40°C ~ 85°C | - | 1356-BBGA, FCBGA | 1356-FCBGA (37.5x37.5) |
||
NXP |
8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
|
封装: - |
Request a Quote |
|
4 Core, 32/64-Bit | 400MHz, 1.3GHz | Multimedia; NEON | DDR3L SDRAM, LPDDR4 DRAM | No | - | 2.5Gbps (3) | - | USB 2.0 OTG (1) | 1.8V, 3.3V | -40°C ~ 105°C (TA) | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | 525-FBGA, FCBGA | 525-FCPBGA (19x19) |
||
Texas Instruments |
IC MPU OMAP-L1X 375MHZ 361NFBGA
|
封装: - |
Request a Quote |
|
1 Core, 32-Bit | 375MHz | Signal Processing; C674x, System Control; CP15 | DDR2, LPDDR | No | LCD | 10/100Mbps (1) | SATA 3Gbps (1) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | 1.8V, 3.3V | - | Boot Security, Cryptography | 361-LFBGA | 361-NFBGA (16x16) |
||
Harris Corporation |
IC MPU 8MHZ 40CERDIP
|
封装: - |
Request a Quote |
|
1 Core, 16-Bit | 8MHz | - | - | No | - | - | - | - | 5V | 0°C ~ 70°C (TA) | - | 40-CDIP (0.600", 15.24mm) | 40-CERDIP |
||
NXP |
IC MPU QORLQ 1.8GHZ 1517FCPBGA
|
封装: - |
Request a Quote |
|
16 Core, 64-Bit | 1.8GHz | - | DDR4 | Yes | - | 100Gbps (2) | SATA 3.0 (4) | USB 3.0 (2) + PHY (2) | 1.2V, 1.8V, 3.3V | -40°C ~ 105°C (TJ) | Secure Boot, TrustZone® | 1517-BBGA, FCBGA | 1517-FCPBGA (40x40) |
||
Renesas Electronics Corporation |
16-BIT, FLASH, H8
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
IBM |
IC MPU 200MHZ 316EPBGA
|
封装: - |
Request a Quote |
|
1 Core, 32-Bit | 200MHz | - | SDRAM | No | - | - | - | - | 3.3V | -40°C ~ 85°C (TC) | - | 316-BBGA | 316-EPBGA (27x27) |
||
NXP |
LAYERSCAPE 64-BIT ARM CORTEX-A72
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - | 1517-BBGA, FCBGA | 1517-FCPBGA (40x40) |
||
Renesas Electronics Corporation |
IC MPU RZ 200MHZ/1.2GHZ 551BGA
|
封装: - |
库存120 |
|
2 Core, 64-Bit | 200MHz, 1.2GHz | ARM® Mali-G31, Multimedia; NEON™ SIMD | DDR3L, DDR4 | Yes | LCD, MIPI/CSI, MIPI/DSI | 10/100/1000Mbps (2) | - | USB 2.0 (2) | 1.8V, 3.3V | -40°C ~ 85°C (TA) | - | 551-LFBGA | 551-LFBGA (21x21) |