页 2 - 嵌入式 - 微控制器，微处理器，FPGA 模块 | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-9P-V247-Z1	Digi International	CONNECTCORE 9P 128MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存7,168	-	-	-	-	-	-	-	-
SOMAM3703-30-1780AKIR	Logic	SYSTEM ON MODULE TORP Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3703 Co-Processor: - Speed: 800MHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.06" (15mm x 27mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,528	ARM? Cortex?-A8, AM3703	-	800MHz	512MB	256MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.06" (15mm x 27mm)	-40°C ~ 85°C
CC-9C-V237-Z1	Digi International	MODULE 9C 64MB SDRAM 128MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 128MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存3,488	ARM926EJ-S, NS9360	-	155MHz	128MB	64MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
CENGLH7A404-11-503HCR	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存4,784	ARM922T, LH7A404	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
101-0562	Digi International	MODULE RABBITCORE RCM3410 W/AD Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 29.4MHz Flash Size: 256KB RAM Size: 256KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.16" x 1.38" (29.5mm x 34.9mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存4,896	Rabbit 3000	-	29.4MHz	256KB	256KB	2 IDC Headers 2x17	1.16" x 1.38" (29.5mm x 34.9mm)	-40°C ~ 85°C
101-0404	Digi International	MODULE RABBITCORE RCM2000 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 25.8MHz Flash Size: 256KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x20 Size / Dimension: 1.9" x 2.3" (48.3mm x 58.4mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存2,912	Rabbit 2000	-	25.8MHz	256KB	512KB	2 IDC Headers 2x20	1.9" x 2.3" (48.3mm x 58.4mm)	-40°C ~ 85°C
DC-EM-02T-S-25	Digi International	EM 8MB SDRAM 4MB FLASH 25 PAK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存3,168	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.94" x 1.58" (49.2mm x 40.0mm)	-40°C ~ 85°C
CC-9P-V513-C-B	Digi International	MOD 9P 16MB SDRAM 8MB FLSH 25PK Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 8MB RAM Size: 16MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存5,888	ARM926EJ-S, NS9215	-	150MHz	8MB	16MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
TE0710-02-35-2CF	Trenz Electronic GmbH	SOM ARTIX-7 35T 512 MBYTE DDR3 Module/Board Type: FPGA Core Processor: Artix-7 A35T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: 512MB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存5,488	Artix-7 A35T	-	100MHz	32MB	512MB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
TE0720-03-1CF-S	Trenz Electronic GmbH	STARTER KIT XILINX ZYNQ MICROSOM Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,192	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
DC-ME9-01-JT	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存6,144	-	-	-	-	-	-	-	-
DC-ME4-01T-HPA	Digi International	MODULE DIGI CONNECT ME Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存2,720	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
TE0820-03-03EG-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 80°C	封装: -	库存4,688	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	B2B	1.57" x 1.97" (40mm x 50mm)	0°C ~ 80°C
AM3359-SOM-512M-IND	Olimex LTD	IC Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A8, AM3359 Co-Processor: - Speed: 800MHz Flash Size: 512MB RAM Size: 512MB Connector Type: 40 Pin Size / Dimension: 2.400" L x 1.500" W (61.00mm x 38.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A8, AM3359	-	800MHz	512MB	512MB	40 Pin	2.400" L x 1.500" W (61.00mm x 38.00mm)	-40°C ~ 85°C
TE0712-02-82C36-AW	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Artix-7 A200T	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0813-02-2AE81-A	Trenz Electronic GmbH	MPSOC MODULE WITH AMD ZYNQ ULTRA Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0803-04-2AE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU2CG-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
5728-PX-4AA-RC	Critical Link LLC	TEXAS INSTRUMENTS AM5728 SOM (32 Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A15 Co-Processor: - Speed: 1.5GHz Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310 Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	ARM® Cortex®-A15	-	1.5GHz	32MB	1GB	Board-to-Board (BTB) - 100, Edge Connector - 310	3.460" L x 2.730" W (87.88mm x 69.34mm)	0°C ~ 70°C
TE0712-03-82C36-A	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
TE0745-03-92I31-AK	Trenz Electronic GmbH	SOM WITH AMD ZYNQ 7045-2I AND HE Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-2FBG676I Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Xilinx Zynq 7045 SoC XC7Z045-2FBG676I	-	64MB	1GB	Samtec ST5	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
A10S-P9-A5E-RC-SB	Critical Link LLC	ARRIA 10 SOC MODULE, 480KLE, 6GB Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A9 Co-Processor: NEON™ SIMD Speed: 1.2GHz Flash Size: - RAM Size: 4GB Connector Type: Board-to-Board (BTB) Size / Dimension: 4.000" L x 4.000" W (101.50mm x 101.50mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	ARM® Cortex®-A9	NEON™ SIMD	1.2GHz	-	4GB	Board-to-Board (BTB)	4.000" L x 4.000" W (101.50mm x 101.50mm)	0°C ~ 70°C
TE0712-02-82I36-A	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Artix-7 A200T	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0821-01-3BE21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU3EG-1SFVC784E	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	2GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0808-04-BBE21-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU15EG-1FFVC900E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
ME-XU7-9EG-2I-D12E-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU7 US+ ZU9EG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I Speed: - Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I	-	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
CC-MX-ET7D-ZN	Digi	CONNECTCORE 8 MINI SOM Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4, i.MX8 Co-Processor: - Speed: 1.6GHz Flash Size: - RAM Size: 1GB Connector Type: USB Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-M4, i.MX8	-	1.6GHz	-	1GB	USB	1.770" L x 1.570" W (45.00mm x 40.00mm)	-40°C ~ 85°C
6254-TX-XXD-RC	Critical Link LLC	SOM WITH TI SITARA AM6254, 1.4GH Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53 Co-Processor: NEON SIMD Speed: 1.4GHz Flash Size: - RAM Size: 2GB Connector Type: SO-DIMM-260 Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	ARM® Cortex®-A53	NEON SIMD	1.4GHz	-	2GB	SO-DIMM-260	2.740" L x 1.500" W (69.60mm x 38.10mm)	0°C ~ 70°C
AM0010-02-4AE21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU4CG-1E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.205" L x 1.575" W (56.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq™ UltraScale+™ ZU4CG-1E	-	-	128MB	4GB	Board-to-Board (BTB) Socket	2.205" L x 1.575" W (56.00mm x 40.00mm)	0°C ~ 85°C
TE0820-05-2AE81MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
TE0817-01-7DE21-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU7EV-1FBVB900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C

CC-9P-V247-Z1

Digi International

CONNECTCORE 9P 128MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存7,168

-

SOMAM3703-30-1780AKIR

Logic

SYSTEM ON MODULE TORP

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3703
Co-Processor: -
Speed: 800MHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,528

ARM? Cortex?-A8, AM3703

-

800MHz

512MB

256MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.06" (15mm x 27mm)

-40°C ~ 85°C

CC-9C-V237-Z1

Digi International

MODULE 9C 64MB SDRAM 128MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 128MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存3,488

ARM926EJ-S, NS9360

-

155MHz

128MB

64MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

CENGLH7A404-11-503HCR

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存4,784

ARM922T, LH7A404

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

101-0562

Digi International

MODULE RABBITCORE RCM3410 W/AD

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 29.4MHz
Flash Size: 256KB
RAM Size: 256KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.16" x 1.38" (29.5mm x 34.9mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存4,896

Rabbit 3000

-

29.4MHz

256KB

2 IDC Headers 2x17

1.16" x 1.38" (29.5mm x 34.9mm)

-40°C ~ 85°C

101-0404

Digi International

MODULE RABBITCORE RCM2000

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 25.8MHz
Flash Size: 256KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x20
Size / Dimension: 1.9" x 2.3" (48.3mm x 58.4mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存2,912

Rabbit 2000

-

25.8MHz

256KB

512KB

2 IDC Headers 2x20

1.9" x 2.3" (48.3mm x 58.4mm)

-40°C ~ 85°C

DC-EM-02T-S-25

Digi International

EM 8MB SDRAM 4MB FLASH 25 PAK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.94" x 1.58" (49.2mm x 40.0mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存3,168

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.94" x 1.58" (49.2mm x 40.0mm)

-40°C ~ 85°C

CC-9P-V513-C-B

Digi International

MOD 9P 16MB SDRAM 8MB FLSH 25PK

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 8MB
RAM Size: 16MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存5,888

ARM926EJ-S, NS9215

-

150MHz

8MB

16MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

TE0710-02-35-2CF

Trenz Electronic GmbH

SOM ARTIX-7 35T 512 MBYTE DDR3

Module/Board Type: FPGA
Core Processor: Artix-7 A35T
Co-Processor: -
Speed: 100MHz
Flash Size: 32MB
RAM Size: 512MB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存5,488

Artix-7 A35T

-

100MHz

32MB

512MB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

TE0720-03-1CF-S

Trenz Electronic GmbH

STARTER KIT XILINX ZYNQ MICROSOM

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,192

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

DC-ME9-01-JT

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存6,144

-

DC-ME4-01T-HPA

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存2,720

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

TE0820-03-03EG-1EA

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
Operating Temperature: 0°C ~ 80°C

封装: -

库存4,688

Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

2GB

B2B

1.57" x 1.97" (40mm x 50mm)

0°C ~ 80°C

AM3359-SOM-512M-IND

Olimex LTD

IC

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A8, AM3359
Co-Processor: -
Speed: 800MHz
Flash Size: 512MB
RAM Size: 512MB
Connector Type: 40 Pin
Size / Dimension: 2.400" L x 1.500" W (61.00mm x 38.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Cortex®-A8, AM3359

-

800MHz

512MB

40 Pin

2.400" L x 1.500" W (61.00mm x 38.00mm)

-40°C ~ 85°C

TE0712-02-82C36-AW

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Artix-7 A200T

-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0813-02-2AE81-A

Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E

-

128MB

4GB

Board-to-Board (BTB) Socket - 4 x 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0803-04-2AE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU2CG-1SFVC784E

-

128MB

2GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

5728-PX-4AA-RC

Critical Link LLC

TEXAS INSTRUMENTS AM5728 SOM (32

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A15
Co-Processor: -
Speed: 1.5GHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) - 100, Edge Connector - 310
Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
Operating Temperature: 0°C ~ 70°C

封装: -

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ARM® Cortex®-A15

-

1.5GHz

32MB

1GB

Board-to-Board (BTB) - 100, Edge Connector - 310

3.460" L x 2.730" W (87.88mm x 69.34mm)

0°C ~ 70°C

TE0712-03-82C36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

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-

TE0745-03-92I31-AK

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7045-2I AND HE

Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-2FBG676I
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A9

Xilinx Zynq 7045 SoC XC7Z045-2FBG676I

-

64MB

1GB

Samtec ST5

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C

A10S-P9-A5E-RC-SB

Critical Link LLC

ARRIA 10 SOC MODULE, 480KLE, 6GB

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A9
Co-Processor: NEON™ SIMD
Speed: 1.2GHz
Flash Size: -
RAM Size: 4GB
Connector Type: Board-to-Board (BTB)
Size / Dimension: 4.000" L x 4.000" W (101.50mm x 101.50mm)
Operating Temperature: 0°C ~ 70°C

封装: -

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ARM® Cortex®-A9

NEON™ SIMD

1.2GHz

-

4GB

Board-to-Board (BTB)

4.000" L x 4.000" W (101.50mm x 101.50mm)

0°C ~ 70°C

TE0712-02-82I36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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Artix-7 A200T

-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0821-01-3BE21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU3EG-1SFVC784E

ARM® Cortex®-A53, ARM® Cortex®-R5

-

128MB

2GB

2 x 100 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0808-04-BBE21-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU15EG-1FFVC900E

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

ME-XU7-9EG-2I-D12E-R5-0

Enclustra FPGA Solutions

SOM ZYNQ XU7 US+ ZU9EG

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I
Speed: -
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I

-

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

CC-MX-ET7D-ZN

Digi

CONNECTCORE 8 MINI SOM

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4, i.MX8
Co-Processor: -
Speed: 1.6GHz
Flash Size: -
RAM Size: 1GB
Connector Type: USB
Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Cortex®-A53, ARM® Cortex®-M4, i.MX8

-

1.6GHz

-

1GB

USB

1.770" L x 1.570" W (45.00mm x 40.00mm)

-40°C ~ 85°C

6254-TX-XXD-RC

Critical Link LLC

SOM WITH TI SITARA AM6254, 1.4GH

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53
Co-Processor: NEON SIMD
Speed: 1.4GHz
Flash Size: -
RAM Size: 2GB
Connector Type: SO-DIMM-260
Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm)
Operating Temperature: 0°C ~ 70°C

封装: -

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ARM® Cortex®-A53

NEON SIMD

1.4GHz

-

2GB

SO-DIMM-260

2.740" L x 1.500" W (69.60mm x 38.10mm)

0°C ~ 70°C

AM0010-02-4AE21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU4CG-1E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.205" L x 1.575" W (56.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq™ UltraScale+™ ZU4CG-1E

-

128MB

4GB

Board-to-Board (BTB) Socket

2.205" L x 1.575" W (56.00mm x 40.00mm)

0°C ~ 85°C

TE0820-05-2AE81MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

TE0817-01-7DE21-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU7EV-1FBVB900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C