页 34 - 用于 IC 的插座，晶体管 | 连接器，互连器件

D84068B-46

Harwin Inc.

CONN SOCKET

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存6,714

-

8-1437504-3

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

封装: -

库存8,406

3 (Oval)

-

Tin

200µin (5.08µm)

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Tin

200µin (5.08µm)

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

300-032-000

3M

CONN SOCKET SIP 32POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 32 (1 x 32)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 8µin (0.20µm)
Contact Material - Mating: -
Mounting Type: Through Hole
Features: Closed Frame
Termination: -
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 8µin (0.20µm)
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存2,340

32 (1 x 32)

0.100" (2.54mm)

Gold

8µin (0.20µm)

-

Through Hole

Closed Frame

-

0.100" (2.54mm)

Gold

8µin (0.20µm)

-

1-1437538-6

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20µin (0.51µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

封装: -

库存7,110

28 (2 x 14)

0.100" (2.54mm)

Gold

20µin (0.51µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

-

Polyester

-55°C ~ 105°C

1-822473-2

TE Connectivity AMP Connectors

CONN SOCKET PLCC 28POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 28 (4 x 7)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 80µin (2.03µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 80µin (2.03µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic
Operating Temperature: -

封装: -

库存5,076

28 (4 x 7)

0.050" (1.27mm)

Tin

80µin (2.03µm)

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Tin

80µin (2.03µm)

Phosphor Bronze

Thermoplastic

-

2-641260-1

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 8POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存4,626

8 (2 x 4)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 105°C

518-77-256M16-000106

Preci-Dip

CONN SOCKET PGA 256POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 256 (16 x 16)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存8,406

256 (16 x 16)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

2040636-5

TE Connectivity AMP Connectors

SOCKET ASSY LGA1567 0.76AU

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存5,058

-

517-83-365-14-000111

Preci-Dip

CONN SOCKET PGA 365POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 365 (14 x 14)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,526

365 (14 x 14)

0.050" (1.27mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.050" (1.27mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

126-93-624-41-002000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封装: -

库存5,094

24 (2 x 12)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

614-93-642-31-018000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 42POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封装: -

库存8,190

42 (2 x 21)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

124-93-318-41-002000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 18POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封装: -

库存2,664

18 (2 x 9)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

18-3508-311

Aries Electronics

CONN IC DIP SOCKET 18POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,204

18 (2 x 9)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10µin (0.25µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 125°C

32-6508-201

Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存5,022

32 (2 x 16)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 105°C

18-6621-30

Aries Electronics

CONN IC DIP SOCKET 18POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole, Bottom Entry; Through Board
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存5,868

18 (2 x 9)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Through Hole, Bottom Entry; Through Board

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 105°C

104-13-316-41-770000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass Alloy
Housing Material: Thermoplastic
Operating Temperature: -

封装: -

库存3,438

16 (2 x 8)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Press-Fit

0.100" (2.54mm)

Gold

10µin (0.25µm)

Brass Alloy

Thermoplastic

-

16-7980-10

Aries Electronics

CONN SOCKET SIP 16POS TIN

Type: SIP
Number of Positions or Pins (Grid): 16 (1 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存2,682

16 (1 x 16)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 105°C

33-0508-30

Aries Electronics

CONN SOCKET SIP 33POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 33 (1 x 33)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Wire Wrap
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6
Operating Temperature: -55°C ~ 105°C

封装: -

库存3,114

33 (1 x 33)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Gold

10µin (0.25µm)

Brass

Polyamide (PA46), Nylon 4/6

-55°C ~ 105°C

APA-422-G-D

Samtec Inc.

ADAPTOR PLUG

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存4,446

-

10-6501-31

Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,528

10 (2 x 5)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Phosphor Bronze

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10µin (0.25µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 125°C

14-6503-30

Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存6,660

14 (2 x 7)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 105°C

14-3518-11H

Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封装: -

库存2,100

14 (2 x 7)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled

-

3-1437535-4

TE Connectivity AMP Connectors

CONN SOCKET SIP 20POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: -
Operating Temperature: -

封装: -

库存2,394

20 (1 x 20)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

-

614-83-432-31-012101

Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存5,022

32 (2 x 16)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

ICO-314-CTT

Samtec Inc.

CONN IC DIP SOCKET 14POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polyester, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存2,952

14 (2 x 7)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polyester, Glass Filled

-55°C ~ 105°C

115-83-322-41-003101

Preci-Dip

CONN IC DIP SOCKET 22POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存4,410

22 (2 x 11)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

AW 127-30/Z-T

Assmann WSW Components

SOCKET 30 CONTACTS SINGLE ROW

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存2,214

-

940-44-084-17-400000

Mill-Max Manufacturing Corp.

CONN SOCKET PLCC 84POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 84 (4 x 21)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150µin (3.81µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封装: -

库存15,804

84 (4 x 21)

0.050" (1.27mm)

Tin

150µin (3.81µm)

Beryllium Copper

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

110-13-320-41-001000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 20POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封装: -

库存13,404

20 (2 x 10)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10µin (0.25µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

208-7391-55-1902

3M

CONN SOCKET SOIC 8POS GOLD

Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyethersulfone (PES), Glass Filled
Operating Temperature: -55°C ~ 150°C

封装: -

库存22,776

8 (2 x 4)

-

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

30µin (0.76µm)

Beryllium Copper

Polyethersulfone (PES), Glass Filled

-55°C ~ 150°C