页 331 - 用于 IC 的插座，晶体管 | 连接器，互连器件 | 深圳黑森尔电子
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用于 IC 的插座，晶体管

记录 11,083
页  331/370
图片
零件编号
制造商
描述
封装
库存
数量
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
550-10-576M30-001152
Preci-Dip

BGA SOLDER TAIL

  • Type: BGA
  • Number of Positions or Pins (Grid): 576 (30 x 30)
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Brass
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: FR4 Epoxy Glass
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存6,678
576 (30 x 30)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
32-3554-18
Aries Electronics

CONN IC DIP SOCKET ZIF 32POS

  • Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Nickel Boron
  • Contact Finish Thickness - Mating: 50µin (1.27µm)
  • Contact Material - Mating: Beryllium Nickel
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Nickel Boron
  • Contact Finish Thickness - Post: 50µin (1.27µm)
  • Contact Material - Post: Beryllium Nickel
  • Housing Material: Polyetheretherketone (PEEK), Glass Filled
  • Operating Temperature: -55°C ~ 250°C
封装: -
库存4,824
32 (2 x 16)
0.100" (2.54mm)
Nickel Boron
50µin (1.27µm)
Beryllium Nickel
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Nickel Boron
50µin (1.27µm)
Beryllium Nickel
Polyetheretherketone (PEEK), Glass Filled
-55°C ~ 250°C
169-PLS17012-12
Aries Electronics

CONN SOCKET PGA ZIF GOLD

  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -65°C ~ 125°C
封装: -
库存2,160
-
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 125°C
68-PLS11033-12
Aries Electronics

CONN SOCKET PGA ZIF GOLD

  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS)
  • Operating Temperature: -65°C ~ 125°C
封装: -
库存2,034
-
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 125°C
44-3574-16
Aries Electronics

CONN IC DIP SOCKET ZIF 44POS TIN

  • Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 44 (2 x 22)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature: -
封装: -
库存7,920
44 (2 x 22)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
39-0511-11
Aries Electronics

CONN SOCKET SIP 39POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 39 (1 x 39)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存5,238
39 (1 x 39)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole
-
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
36-6503-21
Aries Electronics

CONN IC DIP SOCKET 36POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 36 (2 x 18)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存8,496
36 (2 x 18)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
514-83-145-15-081117
Preci-Dip

CONN SOCKET PGA 145POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 145 (15 x 15)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存8,946
145 (15 x 15)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
25-7450-10
Aries Electronics

CONN SOCKET SIP 25POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 25 (1 x 25)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Elevated
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存5,526
25 (1 x 25)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
32-C212-00
Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Surface Mount
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存8,604
32 (2 x 16)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
26-820-90C
Aries Electronics

CONN IC DIP SOCKET 26POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 26 (2 x 13)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole, Right Angle, Horizontal
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存5,526
26 (2 x 13)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
16-1508-31
Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

  • Type: DIP, 0.2" (5.08mm) Row Spacing
  • Number of Positions or Pins (Grid): 16 (2 x 8)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存8,694
16 (2 x 8)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6
-55°C ~ 125°C
146-83-648-41-036101
Preci-Dip

CONN IC DIP SOCKET 48POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 48 (2 x 24)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Press-Fit
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存7,758
48 (2 x 24)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Press-Fit
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
40-1518-10H
Aries Electronics

CONN IC DIP SOCKET 40POS GOLD

  • Type: DIP, 0.2" (5.08mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
封装: -
库存8,640
40 (2 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
510-87-108-12-051101
Preci-Dip

CONN SOCKET PGA 108POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 108 (12 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存8,514
108 (12 x 12)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
20-6511-10
Aries Electronics

CONN IC DIP SOCKET 20POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: 200µin (5.08µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存6,084
20 (2 x 10)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
299-43-610-10-002000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 10POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 10 (2 x 5)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole, Right Angle, Horizontal
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存2,574
10 (2 x 5)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
510-87-084-13-081101
Preci-Dip

CONN SOCKET PGA 84POS GOLD

  • Type: PGA
  • Number of Positions or Pins (Grid): 84 (13 x 13)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存2,808
84 (13 x 13)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
117-83-428-41-105101
Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.070" (1.78mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.070" (1.78mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存2,376
28 (2 x 14)
0.070" (1.78mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
117-83-640-41-005101
Preci-Dip

CONN IC DIP SOCKET 40POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.070" (1.78mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.070" (1.78mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存2,376
40 (2 x 20)
0.070" (1.78mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
22-1518-10H
Aries Electronics

CONN IC DIP SOCKET 22POS GOLD

  • Type: DIP, 0.2" (5.08mm) Row Spacing
  • Number of Positions or Pins (Grid): 22 (2 x 11)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
封装: -
库存3,096
22 (2 x 11)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
D0822-42
Harwin Inc.

CONN IC DIP SOCKET 22POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 22 (2 x 11)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 196.8µin (5.00µm)
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存3,508
22 (2 x 11)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
07-0513-11
Aries Electronics

CONN SOCKET SIP 7POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 7 (1 x 7)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 10µin (0.25µm)
  • Contact Material - Post: Brass
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Operating Temperature: -
封装: -
库存8,118
7 (1 x 7)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
116-87-424-41-018101
Preci-Dip

CONN IC DIP SOCKET 24POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Elevated, Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存6,498
24 (2 x 12)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
211-1-28-006
CNC Tech

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass
  • Housing Material: Polybutylene Terephthalate (PBT)
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存6,354
28 (2 x 14)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polybutylene Terephthalate (PBT)
-55°C ~ 105°C
110-43-424-41-001000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 24POS GOLD

  • Type: DIP, 0.4" (10.16mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存3,978
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1052000008
Molex, LLC

SMIA55 CAMERA SOCKET BOTTOM CONT

  • Type: Camera Socket
  • Number of Positions or Pins (Grid): 12 (2 x 6)
  • Pitch - Mating: 0.028" (0.70mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 12µin (0.30µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount, Through Board
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.028" (0.70mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Copper Alloy
  • Housing Material: Thermoplastic
  • Operating Temperature: -55°C ~ 85°C
封装: -
库存8,406
12 (2 x 6)
0.028" (0.70mm)
Gold
12µin (0.30µm)
Copper Alloy
Surface Mount, Through Board
Open Frame
Solder
0.028" (0.70mm)
Gold
Flash
Copper Alloy
Thermoplastic
-55°C ~ 85°C
110-91-306-41-001000
Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 6POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 6 (2 x 3)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 10µin (0.25µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: 200µin (5.08µm)
  • Contact Material - Post: Brass Alloy
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存5,598
6 (2 x 3)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
840-AG11D-ESL-LF
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: Flash
  • Contact Material - Post: Copper
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
  • Operating Temperature: -55°C ~ 105°C
封装: -
库存13,056
40 (2 x 20)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
D01-9970642
Harwin Inc.

CONN SOCKET SIP 6POS GOLD

  • Type: SIP
  • Number of Positions or Pins (Grid): 6 (1 x 6)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: Flash
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: -
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: 196.8µin (5.00µm)
  • Contact Material - Post: Brass
  • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
  • Operating Temperature: -55°C ~ 125°C
封装: -
库存14,814
6 (1 x 6)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C