页 326 - 用于 IC 的插座，晶体管 | 连接器，互连器件

2-382714-1

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存2,988

20 (2 x 10)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 105°C

DIP306-001BLF

Amphenol FCI

CONN IC DIP SOCKET 6POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -

封装: -

库存3,330

6 (2 x 3)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-

1825108-1

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15µin (0.38µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存6,876

24 (2 x 12)

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Thermoplastic, Glass Filled

-55°C ~ 125°C

1-1825093-1

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 6POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存7,002

6 (2 x 3)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 125°C

540-99-028-17-400200

Mill-Max Manufacturing Corp.

CONN SOCKET PLCC 28POS TIN-LEAD

Type: PLCC
Number of Positions or Pins (Grid): 28 (4 x 7)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: -
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: -
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -

封装: -

库存7,074

28 (4 x 7)

0.050" (1.27mm)

Tin-Lead

200µin (5.08µm)

-

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin-Lead

200µin (5.08µm)

-

Polyphenylene Sulfide (PPS)

-

558-10-504M29-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

Type: BGA
Number of Positions or Pins (Grid): 504 (29 x 29)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Brass
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存7,362

504 (29 x 29)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

518-77-388M26-001106

Preci-Dip

CONN SOCKET PGA 388POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 388 (26 x 26)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存8,676

388 (26 x 26)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.050" (1.27mm)

Gold

Flash

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

44-3551-18

Aries Electronics

CONN IC DIP SOCKET ZIF 44POS

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 44 (2 x 22)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Operating Temperature: -55°C ~ 250°C

封装: -

库存6,264

44 (2 x 22)

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled

-55°C ~ 250°C

36-6554-18

Aries Electronics

CONN IC DIP SOCKET ZIF 36POS

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Operating Temperature: -55°C ~ 250°C

封装: -

库存4,554

36 (2 x 18)

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled

-55°C ~ 250°C

550-10-400M20-000166

Preci-Dip

BGA PIN ADAPTER 1.27MM SMD

Type: BGA
Number of Positions or Pins (Grid): 400 (20 x 20)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: FR4 Epoxy Glass
Operating Temperature: -55°C ~ 125°C

封装: -

库存4,356

400 (20 x 20)

0.050" (1.27mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

10µin (0.25µm)

Brass

FR4 Epoxy Glass

-55°C ~ 125°C

44-6571-16

Aries Electronics

CONN IC DIP SOCKET ZIF 44POS

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 44 (2 x 22)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

封装: -

库存4,266

44 (2 x 22)

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled

-

40-6823-90T

Aries Electronics

CONN IC DIP SOCKET 40POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6
Operating Temperature: -

封装: -

库存6,300

40 (2 x 20)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6

-

110-93-964-41-105000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 64POS GOLD

Type: DIP, 0.9" (22.86mm) Row Spacing
Number of Positions or Pins (Grid): 64 (2 x 32)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封装: -

库存5,940

64 (2 x 32)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

146-93-314-41-013000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,132

14 (2 x 7)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Press-Fit

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

20-7590-10

Aries Electronics

CONN SOCKET SIP 20POS TIN

Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存5,040

20 (1 x 20)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 105°C

510-83-155-16-093101

Preci-Dip

CONN SOCKET PGA 155POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 155 (16 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存7,704

155 (16 x 16)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

346-93-146-41-013000

Mill-Max Manufacturing Corp.

CONN SOCKET SIP 46POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 46 (1 x 46)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封装: -

库存2,070

46 (1 x 46)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

-

Press-Fit

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

14-3503-20

Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存8,424

14 (2 x 7)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 105°C

510-83-069-11-061101

Preci-Dip

CONN SOCKET PGA 69POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 69 (11 x 11)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,438

69 (11 x 11)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

714-43-210-31-018000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 10POS GOLD

Type: DIP, 0.1" (2.54mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封装: -

库存8,748

10 (2 x 5)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

614-87-964-31-012101

Preci-Dip

CONN IC DIP SOCKET 64POS GOLD

Type: DIP, 0.9" (22.86mm) Row Spacing
Number of Positions or Pins (Grid): 64 (2 x 32)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存7,956

64 (2 x 32)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

123-87-652-41-001101

Preci-Dip

CONN IC DIP SOCKET 52POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 52 (2 x 26)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存5,346

52 (2 x 26)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

115-83-648-41-003101

Preci-Dip

CONN IC DIP SOCKET 48POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存4,374

48 (2 x 24)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

19-0513-10

Aries Electronics

CONN SOCKET SIP 19POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封装: -

库存2,502

19 (1 x 19)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled

-

116-87-424-41-002101

Preci-Dip

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存7,164

24 (2 x 12)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

116-83-316-41-009101

Preci-Dip

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存2,088

16 (2 x 8)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

115-87-324-41-003101

Preci-Dip

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存4,482

24 (2 x 12)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

123-83-310-41-001101

Preci-Dip

CONN IC DIP SOCKET 10POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存6,966

10 (2 x 5)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

110-83-308-41-001101

Preci-Dip

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存6,030

8 (2 x 4)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

116-83-306-41-018101

Preci-Dip

CONN IC DIP SOCKET 6POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存4,554

6 (2 x 3)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C