页 8 - 用于 IC 的插座，晶体管 - 适配器 | 连接器，互连器件 | 深圳黑森尔电子
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用于 IC 的插座，晶体管 - 适配器

记录 353
页  8/12
图片
零件编号
制造商
描述
封装
库存
数量
Convert To (Adapter End)
Number of Pins
Pitch - Mating
Contact Finish - Mating
Mounting Type
Termination
Pitch - Post
Contact Finish - Post
Housing Material
Board Material
96-100M65
Aries Electronics

SOCKET ADAPTER QFP TO 100PGA

  • Convert From (Adapter End): QFP
  • Convert To (Adapter End): PGA
  • Number of Pins: 100
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封装: -
库存7,596
PGA
100
0.026" (0.65mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
97-AQ132D
Aries Electronics

SOCKET ADAPTER PQFP TO 132PGA

  • Convert From (Adapter End): PQFP
  • Convert To (Adapter End): PGA
  • Number of Pins: 132
  • Pitch - Mating: 0.025" (0.64mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封装: -
库存4,194
PGA
132
0.025" (0.64mm)
Gold
Through Hole
Solder
-
Tin-Lead
-
FR4 Epoxy Glass
97-AQ132D-P
Aries Electronics

SCKT ADPT PQFP-132PGA PANELIZED

  • Convert From (Adapter End): PQFP
  • Convert To (Adapter End): PGA
  • Number of Pins: 132
  • Pitch - Mating: 0.025" (0.64mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封装: -
库存6,696
PGA
132
0.025" (0.64mm)
Gold
Through Hole
Solder
-
Tin-Lead
-
FR4 Epoxy Glass
84-505-110-P
Aries Electronics

SOCKET ADAPTER PLCC TO 84PGA

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): PGA
  • Number of Pins: 84
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封装: -
库存7,740
PGA
84
0.050" (1.27mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
28-354000-11-RC
Aries Electronics

SOCKET ADAPTER DIP TO 28SOIC

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOIC
  • Number of Pins: 28
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
封装: -
库存2,556
SOIC
28
-
Gold
Surface Mount
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
32-652000-10
Aries Electronics

SOCKET ADAPTER PLCC TO 32DIP 0.6

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 32
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封装: -
库存7,200
DIP, 0.6" (15.24mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
24-354000-10
Aries Electronics

SOCKET ADAPTER DIP TO 24SOIC

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOIC
  • Number of Pins: 24
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
封装: -
库存3,510
SOIC
24
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
32-652000-10-P
Aries Electronics

SOCKET ADAPTER PLCC TO 32DIP 0.6

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 32
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封装: -
库存5,346
DIP, 0.6" (15.24mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
20-354000-20
Aries Electronics

SOCKET ADAPTER DIP TO 20SOIC

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOIC
  • Number of Pins: 20
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
封装: -
库存3,150
SOIC
20
0.100" (2.54mm)
Gold
Surface Mount
Solder
0.050" (1.27mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
32-650000-10-P
Aries Electronics

SOCKET ADAPTER SOIC TO 32DIP 0.6

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 32
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封装: -
库存4,914
DIP, 0.6" (15.24mm) Row Spacing
32
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
16-354W00-20
Aries Electronics

DIP-TO-SOWIC ADAPTER

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOWIC
  • Number of Pins: 16
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
封装: -
库存3,490
SOWIC
16
0.100" (2.54mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
Polyamide (PA46), Nylon 4/6, Glass Filled
-
20-354W00-10
Aries Electronics

CONN ADAPTER 20PIN DIP TO SOWIC

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOWIC
  • Number of Pins: 20
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
封装: -
库存3,294
SOWIC
20
0.100" (2.54mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
Polyamide (PA46), Nylon 4/6, Glass Filled
-
20-351000-10
Aries Electronics

SOCKET ADAPTER SSOP TO 20DIP 0.3

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 20
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封装: -
库存8,118
DIP, 0.3" (7.62mm) Row Spacing
20
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
18-351000-10
Aries Electronics

SOCKET ADAPTER SSOP TO 18DIP 0.3

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 18
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封装: -
库存3,598
DIP, 0.3" (7.62mm) Row Spacing
18
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
16-35W000-11-RC-P (220 UP)
Aries Electronics

SOCKET ADAPT SOIC-W TO 16DIP 0.3

  • Convert From (Adapter End): SOIC-W
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 16
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封装: -
库存7,722
DIP, 0.3" (7.62mm) Row Spacing
16
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
24-350000-10-HT
Aries Electronics

SOCKET ADAPTER SOIC TO 24DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 24
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
封装: -
库存2,268
DIP, 0.3" (7.62mm) Row Spacing
24
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
44-505-110
Aries Electronics

SOCKET ADAPTER PLCC TO 44PGA

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): PGA
  • Number of Pins: 44
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封装: -
库存3,436
PGA
44
0.050" (1.27mm)
-
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
20-350001-10
Aries Electronics

SOCKET ADAPTER SOJ TO 20DIP 0.3

  • Convert From (Adapter End): SOJ
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 20
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封装: -
库存7,920
DIP, 0.3" (7.62mm) Row Spacing
20
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin
-
FR4 Epoxy Glass
LCQT-QFP0.5-80
Aries Electronics

SOCKET ADAPTER MULT PKG TO 80QFP

  • Convert From (Adapter End): Multiple Packages
  • Convert To (Adapter End): QFP
  • Number of Pins: 80
  • Pitch - Mating: 0.020" (0.50mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
封装: -
库存6,930
QFP
80
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
LCQT-QFP0.5-40-1
Aries Electronics

SOCKET ADAPTER MULT PKG TO 40QFP

  • Convert From (Adapter End): Multiple Packages
  • Convert To (Adapter End): QFP
  • Number of Pins: 40
  • Pitch - Mating: 0.020" (0.50mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
封装: -
库存3,366
QFP
40
0.020" (0.50mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
1107254-14
Aries Electronics

SOCKET ADAPTER DIP TO 14DIP 0.3

  • Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 14
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
封装: -
库存8,874
DIP, 0.3" (7.62mm) Row Spacing
14
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
16-350000-11-RC-P
Aries Electronics

SOCKET ADAPTER SOIC TO 16DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 16
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
封装: -
库存3,582
DIP, 0.3" (7.62mm) Row Spacing
16
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
228-1277-09-0602J
3M

SOCKET ADAPTER 28DIP TO 28DIP

  • Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 28
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polysulfone (PSU), Glass Filled
  • Board Material: -
封装: -
库存6,336
DIP, 0.6" (15.24mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
18-350000-11-RC
Aries Electronics

SOCKET ADAPTER SOIC TO 18DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 18
  • Pitch - Mating: -
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
封装: -
库存7,326
DIP, 0.3" (7.62mm) Row Spacing
18
-
Tin
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
Polyimide (PI)
1106396-24
Aries Electronics

SOCKET ADAPTER DIP TO 24DIP 0.6

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 24
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
封装: -
库存8,448
DIP, 0.6" (15.24mm) Row Spacing
24
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
28-351000-11-RC
Aries Electronics

SOCKET ADAPTER SSOP TO 28DIP 0.3

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 28
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封装: -
库存7,560
DIP, 0.3" (7.62mm) Row Spacing
28
0.026" (0.65mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
-
FR4 Epoxy Glass
1106396-28
Aries Electronics

SOCKET ADAPTER DIP TO 28DIP 0.6

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 28
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
封装: -
库存17,124
DIP, 0.6" (15.24mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
LCQT-SOIC16
Aries Electronics

SOCKET ADAPTER SOIC TO 16DIP

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 16
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
封装: -
库存9,672
DIP, 0.6" (15.24mm) Row Spacing
16
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
28-650000-10
Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.6

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 28
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封装: -
库存18,396
DIP, 0.6" (15.24mm) Row Spacing
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
24-650000-10
Aries Electronics

SOCKET ADAPTER SOIC TO 24DIP 0.6

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 24
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
封装: -
库存20,064
DIP, 0.6" (15.24mm) Row Spacing
24
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass