图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics |
CONN IC DIP SOCKET 36POS GOLD
|
封装: - |
库存4,914 |
|
36 (2 x 18) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 18POS TIN
|
封装: - |
库存5,868 |
|
18 (2 x 9) | 0.100" (2.54mm) | Tin | 50µin (1.27µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 50µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
||
Aries Electronics |
CONN IC DIP SOCKET 32POS GOLD
|
封装: - |
库存6,048 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 32POS GOLD
|
封装: - |
库存5,022 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 30POS GOLD
|
封装: - |
库存8,640 |
|
30 (2 x 15) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 30POS GOLD
|
封装: - |
库存2,448 |
|
30 (2 x 15) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 27POS TIN
|
封装: - |
库存7,254 |
|
27 (1 x 27) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 27POS TIN
|
封装: - |
库存4,446 |
|
27 (1 x 27) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 38POS GOLD
|
封装: - |
库存8,856 |
|
38 (2 x 19) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 38POS GOLD
|
封装: - |
库存3,726 |
|
38 (2 x 19) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 38POS GOLD
|
封装: - |
库存8,586 |
|
38 (1 x 38) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 38POS GOLD
|
封装: - |
库存2,214 |
|
38 (1 x 38) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 50POS GOLD
|
封装: - |
库存5,292 |
|
50 (2 x 25) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN SOCKET SIP 21POS GOLD
|
封装: - |
库存5,148 |
|
21 (1 x 21) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 21POS GOLD
|
封装: - |
库存4,320 |
|
21 (1 x 21) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 20POS GOLD
|
封装: - |
库存8,676 |
|
20 (1 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled | - |
||
Aries Electronics |
CONN SOCKET SIP 20POS GOLD
|
封装: - |
库存4,050 |
|
20 (1 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS TIN
|
封装: - |
库存4,320 |
|
48 (2 x 24) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS TIN
|
封装: - |
库存3,978 |
|
48 (2 x 24) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS TIN
|
封装: - |
库存4,050 |
|
48 (2 x 24) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS TIN
|
封装: - |
库存7,632 |
|
48 (2 x 24) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS TIN
|
封装: - |
库存7,776 |
|
48 (2 x 24) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS TIN
|
封装: - |
库存4,590 |
|
48 (2 x 24) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 48POS GOLD
|
封装: - |
库存4,734 |
|
48 (2 x 24) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN SOCKET SIP 14POS GOLD
|
封装: - |
库存3,294 |
|
14 (1 x 14) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS GLD
|
封装: - |
库存4,014 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN SOCKET PGA GOLD
|
封装: - |
库存5,526 |
|
- | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET PGA GOLD
|
封装: - |
库存4,212 |
|
- | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
|
封装: - |
库存5,976 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
|
封装: - |
库存2,988 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |