图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics |
CONN SOCKET SIP 8POS TIN
|
封装: - |
库存3,582 |
|
8 (1 x 8) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
封装: - |
库存4,122 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
封装: - |
库存6,318 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 14POS GOLD
|
封装: - |
库存3,024 |
|
14 (1 x 14) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 14POS GOLD
|
封装: - |
库存6,174 |
|
14 (1 x 14) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 21POS GOLD
|
封装: - |
库存4,068 |
|
21 (1 x 21) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN SOCKET SIP 23POS GOLD
|
封装: - |
库存8,748 |
|
23 (1 x 23) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 6POS GOLD
|
封装: - |
库存2,628 |
|
6 (2 x 3) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 6POS GOLD
|
封装: - |
库存3,690 |
|
6 (2 x 3) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 32POS TIN
|
封装: - |
库存2,790 |
|
32 (2 x 16) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 25POS GOLD
|
封装: - |
库存8,064 |
|
25 (1 x 25) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN SOCKET SIP 29POS GOLD
|
封装: - |
库存8,622 |
|
29 (1 x 29) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
封装: - |
库存6,660 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
封装: - |
库存7,038 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 38POS GOLD
|
封装: - |
库存6,390 |
|
38 (2 x 19) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
|
封装: - |
库存6,444 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
|
封装: - |
库存6,462 |
|
18 (2 x 9) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 20POS TIN
|
封装: - |
库存3,672 |
|
20 (2 x 10) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 20POS TIN
|
封装: - |
库存3,258 |
|
20 (2 x 10) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 15POS GOLD
|
封装: - |
库存8,496 |
|
15 (1 x 15) | - | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle | - | Solder | - | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
|
封装: - |
库存6,048 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
封装: - |
库存4,806 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
封装: - |
库存8,424 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 38POS TIN
|
封装: - |
库存6,894 |
|
38 (2 x 19) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 8POS GOLD
|
封装: - |
库存3,060 |
|
8 (1 x 8) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled | - |
||
Aries Electronics |
CONN SOCKET SIP 8POS GOLD
|
封装: - |
库存7,614 |
|
8 (1 x 8) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
封装: - |
库存8,496 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
封装: - |
库存6,156 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 14POS TIN
|
封装: - |
库存3,654 |
|
14 (1 x 14) | 0.100" (2.54mm) | Tin | 50µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 50µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 16POS GOLD
|
封装: - |
库存7,092 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |